Introduction
Vanadium Aluminum sputtering targets are alloy materials designed for advanced thin-film deposition where controlled electrical, mechanical, and chemical properties are required. By combining vanadium’s excellent adhesion and barrier characteristics with aluminum’s lightweight nature and good conductivity, Vanadium Aluminum (V–Al) alloy targets are widely used in microelectronics, protective coatings, and functional thin-film research.
Detailed Description
Vanadium Aluminum is an engineered alloy system in which aluminum is alloyed with vanadium to tailor film stress, electrical behavior, and oxidation resistance. Vanadium contributes strong adhesion to a wide range of substrates and provides effective diffusion-barrier performance, while aluminum enhances electrical conductivity and reduces overall film density.
Our Vanadium Aluminum sputtering targets are produced from high-purity raw materials using vacuum melting and precision machining processes. Strict control of alloy composition ensures excellent homogeneity across the target, which is essential for stable sputtering rates and uniform film composition. High target density and fine microstructure help minimize particle generation and arcing during deposition.
These targets are compatible with DC magnetron sputtering systems and are commonly supplied as planar disc targets. Optional bonding to copper backing plates is available to improve thermal conductivity and mechanical stability during high-power sputtering. Composition ratios, dimensions, and bonding solutions can be customized to match specific deposition requirements.
Applications
Vanadium Aluminum sputtering targets are commonly used in:
Thin-film resistors and conductive layers
Diffusion barrier and adhesion layers
Microelectronics and semiconductor devices
Hard and protective coatings
Functional alloy thin-film research
General PVD coating and R&D applications
Technical Parameters
| Parameter | Typical Value / Range | Importance |
|---|---|---|
| Material | Vanadium Aluminum Alloy (V–Al) | Determines film properties |
| Purity | 99.9% – 99.99% | Reduces contamination |
| Composition | Custom V/Al ratios | Tunes electrical & mechanical behavior |
| Diameter | 1″ – 4″ (custom available) | Fits standard sputtering cathodes |
| Thickness | 3 – 6 mm | Influences target lifetime |
| Density | High, process-controlled | Ensures stable sputtering |
| Backing Plate | Optional Cu | Improves heat dissipation |
Comparison with Related Materials
| Material | Key Advantage | Typical Application |
|---|---|---|
| Vanadium Aluminum | Balanced adhesion & conductivity | Alloy thin films |
| Pure Vanadium | Strong adhesion, barrier layer | Semiconductor devices |
| Pure Aluminum | High conductivity, low density | Interconnects, coatings |
| Titanium Aluminum | High strength, wear resistance | Hard coatings |
FAQ
| Question | Answer |
|---|---|
| Can the V/Al ratio be customized? | Yes, alloy composition can be tailored to your process needs. |
| Is this target suitable for DC sputtering? | Yes, it is commonly used with DC magnetron sputtering systems. |
| Are bonded targets available? | Yes, copper-bonded targets can be supplied. |
| What applications use V–Al thin films most? | Microelectronics, barrier layers, and functional coatings. |
Packaging
Our Vanadium Aluminum Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and strict quality control. Each target is vacuum-sealed and protected with shock-absorbing materials to prevent damage or contamination during storage and transportation.
Conclusion
Vanadium Aluminum sputtering targets offer reliable alloy composition, stable sputtering behavior, and flexible customization options for advanced thin-film applications. Their balanced properties make them a dependable choice for microelectronics, protective coatings, and research-driven PVD processes.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.
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