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ST0920 Vanadium Dioxide Sputtering Target, VO2

Chemical FormulaVO2
Catalog No.ST0920
CAS Number12036-21-4
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Vanadium Dioxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Vanadium Dioxide Sputtering Target Description

Vanadium Dioxide (VO2) Sputtering Target is a specialized material used in the sputter deposition process, which is a technique for producing thin films across various applications, including electronics, optics, and coatings.

VO2 is particularly notable for its metal-insulator transition property. At a specific transition temperature, VO2 shifts from an insulating state to a metallic state, resulting in a significant change in its electrical conductivity. This unique characteristic makes VO2 highly valuable for advanced electronic and optical applications where tunable conductivity is desired.

Related Product: Vanadium Nitride Sputtering Target

Vanadium Dioxide Sputtering Target Specifications

Compound FormulaVO2
Molecular Weight82.94
AppearanceBlack Target
Melting Point1967℃
Density (g/cm3)4.339
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Vanadium Dioxide Sputtering Target Handling Notes

Indium bonding is recommended for the Vanadium Dioxide (VO2) Sputtering Target due to certain characteristics that make it less suitable for sputtering in its raw form, such as brittleness and low thermal conductivity. These properties make the material susceptible to thermal shock during the sputtering process. Indium bonding helps to mitigate these issues by providing a more stable and conductive interface, improving the overall performance and longevity of the sputtering target.

Vanadium Dioxide Sputtering Target Application

Vanadium Dioxide (VO2) Sputtering Target is used in a range of applications across electronics, optics, and coatings. The unique properties of VO2, such as its metal-insulator transition, make it particularly valuable in the development of advanced electronic devices, optical components, and specialized coatings.

Vanadium Dioxide Sputtering Target Packaging

Our Vanadium Dioxide Sputtering Targets are meticulously handled during storage and transportation to ensure they remain in their original, high-quality condition.

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TFM offers Vanadium Dioxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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