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ST0200 Vanadium Oxide Sputtering Target, V2O5

Chemical Formula: V2O5
Catalog Number: ST0200
CAS Number: 1314-62-1
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Vanadium Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Vanadium Oxide Sputtering Target Description

The vanadium oxide sputtering target, provided by TFM, is an oxide sputtering material with the chemical formula V₂O₅. This material is commonly used in various applications due to its properties, including its use in thin film deposition processes.

Vanadium is a chemical element named after Vanadis, an old Norse name for the Scandinavian goddess Freyja. It was first identified in 1801 by the mineralogist Andrés Manuel del Río. The isolation and further study of vanadium were later carried out by Nils Gabriel Sefström, who announced its discovery. Vanadium has the chemical symbol “V” and an atomic number of 23. It is situated in Period 4 and Group 5 of the periodic table, which places it in the d-block elements. The relative atomic mass of vanadium is 50.9415(1) Dalton, where the number in brackets indicates the measurement uncertainty.

Related Product: Vanadium Sputtering Target

OxygenOxygen is a chemical element with the symbol “O” and atomic number 8. The name “oxygen” comes from the Greek words ‘oxy’ and ‘genes,’ meaning “acid-forming.” It was first identified by Carl Wilhelm Scheele in 1771, who observed it but did not publish his findings immediately. Joseph Priestley independently discovered oxygen and published his findings in 1774, which led to the widespread recognition of the element. Oxygen is located in Period 2, Group 16 of the periodic table, part of the p-block elements. The relative atomic mass of oxygen is 15.9994(3) Dalton, with the number in parentheses indicating the uncertainty of the measurement.

Vanadium Oxide Sputtering Target Specification

Compound FormulaV2O5
Molecular Weight181.88
AppearanceYellow to rust color
Melting Point690 °C
Density3.35 g/cm3
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Vanadium Oxide Sputtering Target Packaging

Our vanadium oxide sputtering targets are carefully tagged and labeled on the outside to ensure easy identification and strict quality control. We take special precautions during packaging and transportation to prevent any damage, ensuring that the product reaches you in perfect condition.

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TFM offers Vanadium Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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