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VD0795 Ytterbium Fluoride (YbF3) Evaporation Materials

Material Type: Ytterbium Fluoride
Symbol: YbF3
Color/Appearance: Light grey, Crystalline Solid
Purity: 99% ~ 99.99%
Shape: Granules

MSDS File

Overview of Ytterbium Trifluoride Evaporation Materials

Ytterbium Trifluoride (YbF3), or Ytterbium Fluoride, is a crystalline ionic substance with minimal solubility in water. Its key applications include use in fluoride glass and optical film materials. Due to its high light transmittance and low refractive index across a broad spectrum—from ultraviolet to far infrared (0.2–15μm)—YbF3 is a preferred choice in the creation of mid-infrared multilayer films.

Specification of Ytterbium Trifluoride Evaporation Materials

Chemical formulaYbF3
Purity2N-4N
AppearanceGranules
Melting point1157℃
Formula weight230.04
Size0.1-5mm or customized
ColorLight grey

Applications of Ytterbium Trifluoride Evaporation Materials

Ytterbium Trifluoride is renowned for its wide transmission band, making it highly effective in the infrared range. It is utilized in various applications, including:

  • Decorative Coatings: Enhances the aesthetic qualities of surfaces.
  • UV Coatings: Provides protection and functionality in ultraviolet applications.
  • Glass Coatings: Improves optical properties and durability of glass products.

Packaging

Our ytterbium fluoride evaporation materials are meticulously packaged in plastic vacuum bags to ensure protection during storage and transportation. This packaging maintains the integrity of the product and includes a Certificate of Analysis (COA) for verification of quality.

Contact Us

TFM is dedicated to delivering high-purity ytterbium fluoride evaporation materials for applications in semiconductors, chemical vapor deposition (CVD), and physical vapor deposition (PVD). Our strong engineering, manufacturing, and analytical teams work together to produce top-tier evaporation materials. Reach out to us today to inquire about our products.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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