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Yttria Stabilized Zirconia (YSZ) Evaporation Materials

Yttria Stabilized Zirconia (YSZ) Evaporation Materials

Material: Yttria Fully Stabilized Zirconia
Catalog No.: TFM-EVM-0343
Purity: 99.9%
Shape: Powder/ Granule/ Custom-made

Yttria Fully Stabilized Zirconia evaporation material is supplied by Thin Film Materials (TFM) for vacuum evaporation and thin-film deposition. Available form, size, purity, and packaging can be customized to suit research and production requirements.

MSDS File

Product Overview

Yttria Stabilized Zirconia (YSZ) Evaporation Materials (YSZ) is a composition-specific evaporation source for vacuum thin-film deposition and materials-development work. The correct process depends on melting point, vapor pressure, decomposition behavior, reactivity, source geometry, and the required film composition. TFM can supply custom source forms and purities according to the evaporator and application.

Evaporation Behavior and Process Considerations

The evaporation source should be selected according to the material’s melting point, vapor pressure, decomposition behavior, and compatibility with the boat, crucible, or e-beam hearth. A gradual conditioning cycle and stable rate monitoring are useful starting practices for repeatable deposition.

Technical Data

Crystal structurecubic（a=5.125Å ）
Density5.8g/cm3
purity99.99%
Thermal expansivity10.3ppm/℃
Dielectric constant27
Orientation<100>、<110>、<111>±0.5o, or special orientation
Sizedia 2” ×0.5mm, 25×25×0.5mm, 15×15×0.5mm,10×10×0.5mm, 10×5×0.5mm, 5×5×0.5mm, and customized
PolishedOne side or double side polished
Surface roughness≤5Å

Typical Thin-Film Applications

  • Thin-film R&D requiring a composition-specific evaporation source
  • Optical, semiconductor, electronic, energy, and advanced-material coating studies depending on the compound
  • Custom PVD research using pellets, pieces, granules, or other source forms

Source Form and Ordering Considerations

For quotation, provide material, purity, source form, particle or piece size, quantity, evaporation method, and any boat, basket, crucible, or e-beam hearth constraints. If the material will be used for a specific coating stack, sharing the intended film thickness or deposition application can help with source-form selection and packaging recommendations.

Frequently Asked Questions

How should the evaporation method for Yttria Stabilized Zirconia (YSZ) be selected?

Select the method from melting point, vapor pressure, decomposition behavior, charge size, and the available source hardware. Resistance heating and electron-beam evaporation are the most common starting options.

What source form is available for Yttria Stabilized Zirconia (YSZ)?

Depending on the material, pellets, pieces, granules, tablets, or other compact forms can be reviewed for compatibility with the customer’s evaporator.

Why is source preconditioning important for Yttria Stabilized Zirconia (YSZ)?

Gradual preheating can remove adsorbed gas, stabilize the charge, and reduce spitting or pressure excursions before film deposition.

Can the film composition differ from the Yttria Stabilized Zirconia (YSZ) source?

Yes. Preferential evaporation, decomposition, re-evaporation, and substrate conditions can all change the final film composition.

Does purity matter for Yttria Stabilized Zirconia (YSZ) evaporation material?

Yes. Source purity contributes directly to the contamination budget of the deposited film, together with chamber, crucible, and substrate cleanliness.

What information should I send TFM for a Yttria Stabilized Zirconia (YSZ) RFQ?

Provide material or formula, purity, source form and size, quantity, evaporation method, holder constraints, and any film or documentation requirements.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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