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ST0931 Yttrium Aluminum Oxide Sputtering Target, Y3Al5O12, YAG

Chemical FormulaY3Al5O12
Catalog No.ST0931
CAS Number12005-21-9
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Yttrium Aluminum Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Yttrium Aluminum Oxide Sputtering Target Description

The Yttrium Aluminum Oxide Sputtering Target is a crucial material in the sputtering process, used to deposit thin films onto various substrates. Comprising yttrium (Y), aluminum (Al), and oxygen (O), this compound is employed as the target in sputtering operations.

During sputtering, high-energy ions bombard the Yttrium Aluminum Oxide Sputtering Target, causing atoms or molecules to be ejected from its surface. These ejected particles then transfer to a substrate, where they form a thin film that retains the properties of the yttrium aluminum oxide.

Sputtering targets are available in various shapes and sizes, tailored to the specific needs of the thin film deposition process and the sputtering equipment being used. The selection of a yttrium aluminum oxide sputtering target depends on the desired characteristics of the thin film and its intended application, ensuring optimal performance and functionality.

Related Product: Yttrium Oxide Sputtering Target

Yttrium Aluminum Oxide Sputtering Target Specifications

Compound FormulaY3Al5O12
Molecular Weight593.62
AppearanceBlack Target
Melting Point (℃)N/A
Density (g/cm3)4.56
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Yttrium Aluminum Oxide Sputtering Target Handling Notes

Indium bonding is advised for the Yttrium Aluminum Oxide Sputtering Target due to the material’s inherent properties that can pose challenges during sputtering. Yttrium aluminum oxide is known for its brittleness and low thermal conductivity, which makes it sensitive to thermal shock. To enhance the target’s performance and stability during sputtering, indium bonding provides a more effective solution, addressing these issues and ensuring reliable operation.

Yttrium Aluminum Oxide Sputtering Target Application

  • Yttrium aluminum oxide thin films have a range of applications across various fields:
    • Optical Coatings: These films are used in optical coatings, including anti-reflective coatings, beam splitters, and laser coatings. Their properties enhance optical performance and durability.
    • Laser Technology: Yttrium aluminum oxide is widely utilized in the production of laser crystals, notably for neodymium-doped yttrium aluminum garnet (Nd) lasers, which are essential in many high-precision applications.
    • Scintillators: This material is used in the manufacture of scintillators, which are crucial for medical imaging devices and other detection technologies.
    • Semiconductor Manufacturing: In the semiconductor industry, yttrium aluminum oxide coatings are applied in the fabrication of electronic and optoelectronic devices, contributing to their performance and reliability.

Yttrium Aluminum Oxide Sputtering Target Packaging

Our Yttrium Aluminum Oxide Sputtering Target is extensively utilized in creating coatings for a variety of applications. These coatings enhance the wear resistance of tools, boost surface durability, and impart specific optical or electrical properties. Whether for industrial equipment, protective surfaces, or specialized optical and electronic applications, our Yttrium Aluminum Oxide Sputtering Target delivers exceptional performance and tailored solutions.

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TFM offers Yttrium Aluminum Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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