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Yttrium Orthoaluminate Substrate

Yttrium Orthoaluminate Substrate (YAlO3)

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Yttrium Orthoaluminate Substrate Substrate Overview

TFM offers high-quality Yttrium Orthoaluminate substrates (YAlO₃), known for their excellent crystal structure, high thermal stability, and superior dielectric properties. These substrates are ideal for epitaxial growth of complex oxide films and are widely used in applications such as ferroelectrics, photonics, and high-temperature electronics.

YAlO₃ substrates provide outstanding lattice matching with a variety of perovskite oxide materials, making them ideal for oxide electronics and quantum material research. Their high thermal and chemical stability ensures reliability in harsh environments, while their high refractive index and optical transparency make them suitable for optical coatings and photonic devices. These substrates are also commonly used in piezoelectric and ferroelectric devices, where high-quality interfaces are essential.

TFM supplies customized YAlO₃ substrates tailored to meet the precise requirements of advanced research and device applications, ensuring optimal performance and material integrity for next-generation electronic, optoelectronic, and photonic technologies.

Yttrium Orthoaluminate Substrate Substrate Physical Properties

MaterialYAlO3 (YAP)
StructureOrthor.
Lattice (A)a=5.176, b=5.307, c= 7.355
Melting Point1870℃
Density(g/cm3)5.37 g/cm3
Dielectric Constant16-20
Thermal-expans2-10 x 10-6 /K

YAlO3 Substrate Specifications

Size10×3, 10×5, 10×10, 15×15, 20x 15, 20x 20,Dia 1”, Dia 30 mm
Thickness0.5 mm, 1.0 mm
PolishedSSP or DSP
Orientation<100>,<010>,<001>, <110>
Redirection Precision±0.5°
Redirection the Edge2°（special in 1°）
Angle of CrystallineSpecial size and orientation are available on demand.
Ra:≤5Å（5µm×5µm）

YAlO3 Substrate Packaging

Each substrate is packaged in a class 100 clean bag or wafer container, prepared in a class 1000 clean room to ensure optimal quality and performance.

Ideal for advanced research and industrial applications, YAlO3 substrates offer exceptional thermal stability, precision, and versatility.

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FAQ

A thin film substrate is the base material upon which thin layers of materials are deposited to create electronic, optical, or mechanical devices. The substrate provides structural support and can influence the properties of the thin film.

The choice of substrate affects the film’s structural integrity, electrical properties, and overall performance. Factors like thermal expansion coefficient, surface smoothness, and chemical compatibility are crucial considerations.

Materials such as lanthanum aluminate (LaAlO₃), magnesium oxide (MgO), and strontium titanate (SrTiO₃) are commonly used due to their lattice compatibility and thermal stability, which are essential for optimal superconducting properties.

Metal substrates offer high electrical and thermal conductivity, making them suitable for applications requiring efficient heat dissipation and electrical connectivity. However, their surface properties and potential for oxidation must be managed during deposition.

These substrates are materials that can support the growth of thin films exhibiting magnetic or ferroelectric properties, essential for applications in memory devices, sensors, and actuators.

Semiconductor substrates, such as silicon wafers, serve as the foundation for integrated circuits and various electronic components, providing the necessary electrical characteristics and structural support for device fabrication.

Gallium Nitride (GaN) substrates are pivotal for high-performance optoelectronic and power devices due to their excellent thermal conductivity, high breakdown voltage, and efficiency. They are widely used in LEDs, power transistors, and RF components.

Halide crystal substrates, composed of halide compounds, are utilized in specialized optical applications, including infrared spectroscopy and laser systems, due to their unique optical properties.
Ceramic substrates provide high thermal stability, mechanical strength, and electrical insulation, making them ideal for high-frequency and high-power applications.
Proper surface preparation, including cleaning and polishing, ensures the removal of contaminants and surface irregularities, leading to improved film adhesion, uniformity, and performance.
Yes, thin films can be deposited on flexible substrates like polymers, enabling the development of flexible electronics and wearable devices. However, challenges include managing mechanical stress and ensuring film adhesion.
Challenges include ensuring lattice matching to minimize defects, managing thermal expansion differences to prevent stress and delamination, and achieving desired electrical and optical properties for specific applications.
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