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VD0660A Zinc Antimony Pellet Evaporation Material (ZnSb)

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Zinc Antimony Pellet Evaporation Material

Introduction

Zinc Antimony Pellet Evaporation Material is a high-purity alloy evaporation source designed for use in thermal and electron-beam (e-beam) evaporation systems. This binary compound of zinc (Zn) and antimony (Sb) provides excellent film uniformity, adhesion, and stability, making it suitable for thin film deposition in electronics, optics, and semiconductor research. The Zn–Sb system is particularly valued for its tunable electronic and thermoelectric properties.

Detailed Description

Zinc Antimony (ZnSb) combines the electrical conductivity of zinc with the thermoelectric efficiency and chemical stability of antimony. The pellets are fabricated through precise melting and solidification processes to achieve high homogeneity and density. The composition can be adjusted—commonly Zn₄Sb₃ or near-stoichiometric ZnSb—to meet specific film property requirements.

When used in evaporation, ZnSb pellets evaporate cleanly, forming films with smooth morphology and low defect density. The alloy’s stable vapor pressure and excellent thermal behavior allow consistent deposition even under high vacuum and elevated temperatures.

Key Features:

  • High-purity (≥99.9%) alloy ensuring clean film formation.

  • Stable evaporation rate and reproducible deposition behavior.

  • Uniform composition suitable for both resistance and e-beam evaporation.

  • Custom pellet sizes for crucibles and evaporation sources.

Applications

Zinc Antimony pellets are widely used in:

  • Thermoelectric thin films – for high-efficiency power generation and cooling devices.

  • Semiconductor coatings – ZnSb layers for junctions and barrier materials.

  • Optical coatings – reflective and functional films for IR optics.

  • R&D and material science – studies of p-type semiconductors and layered alloy films.

  • Energy devices – advanced thin films for energy conversion and solid-state cooling.

Technical Parameters

ParameterTypical Value / RangeImportance
CompositionZnSb or Zn₄Sb₃ (custom)Determines thermoelectric and film properties
Purity99.9% – 99.999%Reduces film contamination
Melting Point~600 – 650 °CCompatible with standard evaporation systems
Density6.4 – 6.7 g/cm³Ensures consistent evaporation
FormPellets / Chunks / PiecesFits crucibles and e-beam pockets

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Zinc Antimony (ZnSb)Good thermoelectric efficiencyEnergy conversion films
Antimony (Sb)High reflectivity and conductivityOptical coatings
Zinc (Zn)High conductivity, easy evaporationTransparent films
Bismuth Telluride (Bi₂Te₃)Excellent thermoelectric propertiesCooling and power devices

FAQ

QuestionAnswer
Can ZnSb pellets be customized?Yes, size, purity, and Zn:Sb ratios can be adjusted.
What crucible materials are recommended?Alumina, graphite, or tungsten crucibles.
Are these pellets suitable for e-beam evaporation?Yes, they perform well under both resistance and e-beam systems.
How are they packaged?Vacuum-sealed in inert atmosphere, cushioned for export safety.
What industries use ZnSb the most?Thermoelectric, semiconductor, and optical coating industries.

Packaging

Each Zinc Antimony Pellet Evaporation Material is vacuum-sealed in an inert environment to prevent oxidation. Packaging includes anti-static bags, foam cushioning, and export-grade cartons or wooden boxes for secure shipment.

Conclusion

Zinc Antimony evaporation pellets offer a reliable and efficient source for producing uniform thin films with excellent electrical and thermal characteristics. Their versatility and stability make them ideal for cutting-edge thermoelectric and semiconductor applications.

For detailed specifications and quotations, please contact us at [sales@thinfilmmaterials.com].

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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