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VD0660B Zinc Arsenic Pellet Evaporation Material (ZnAs)

MSDS File
Material TypeZinc Arsenic
SymbolZnAs
Melting Point (°C)
Theoretical Density (g/cc)
Z Ratio
E-Beam
E-Beam Crucible Liner Material
Temp. (°C) for Given Vap. Press. (Torr)
Comments

Zinc Arsenic Pellet Evaporation Material

TFM offers high-quality Zinc Arsenic Pellet Evaporation Material, engineered for thin-film deposition in advanced semiconductor and optoelectronic applications. The Zinc Arsenic alloy, composed of zinc (Zn) and arsenic (As), is prized for its unique electrical and optical properties, making it ideal for use in photodetectors, solar cells, and other optoelectronic devices.

The evaporation process utilizing Zinc Arsenic pellets enables precise control over film composition and uniformity, ensuring the production of high-purity thin films. This results in films with excellent performance characteristics, which are critical for high-efficiency photovoltaic devices, infrared sensors, and advanced electronic components.

In addition to its superior deposition characteristics, the Zinc Arsenic Pellet Evaporation Material offers robust thermal stability and mechanical strength. These properties contribute to the material’s ability to withstand demanding processing environments, ensuring long-term reliability in high-tech applications.

TFM provides customized Zinc Arsenic Pellet Evaporation Material with stringent control over composition and purity, catering to the specific requirements of modern thin-film technologies. Whether for research or industrial production, TFM’s material is optimized to deliver consistent, high-performance results in cutting-edge optoelectronic and semiconductor devices.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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