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Zinc Copper Sputtering Target

ST0123 Zinc Copper Sputtering Target, Zn/Cu

Chemical Formula: Zn/Cu
Catalog Number: ST0123
CAS Number: 7440-66-6 | 7440
Purity: 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Zinc Copper  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Zinc Copper Sputtering Target

Introduction

The Zinc Copper Sputtering Target is an essential material in thin film deposition, valued for its unique combination of zinc’s corrosion resistance and copper’s electrical and thermal conductivity. By integrating these two metals, the target offers superior film properties that are highly suitable for applications in semiconductors, transparent conductive coatings, decorative layers, and energy devices.

Detailed Description

Our Zinc Copper Sputtering Target is manufactured with strict control over composition, density, and purity to ensure stable deposition rates and consistent film performance. The alloy is typically prepared by vacuum melting or powder metallurgy, resulting in a target with fine microstructure and minimal defects.

  • Purity: Typically available at 99.9% or higher, minimizing contamination in sensitive thin film applications.

  • Composition Control: Zinc and copper content can be precisely tailored to achieve desired electrical and optical properties.

  • Bonding Options: Backing plates such as copper or titanium can be applied for improved heat dissipation and mechanical stability during high-power sputtering.

  • Surface Finish: Precision machining ensures a smooth surface to reduce arcing and particle generation in the sputtering process.

These design features help optimize the deposition of uniform thin films with excellent adhesion and performance characteristics.

Applications

The Zinc Copper Sputtering Target is widely used across various industries, including:

  • Semiconductor fabrication – conductive and barrier layers.

  • Transparent conductive films – coatings for displays, touch panels, and solar cells.

  • Optical coatings – anti-reflective or decorative layers.

  • Decorative coatings – jewelry, hardware, and consumer electronics.

  • Energy storage and conversion – electrodes for advanced battery and fuel cell technologies.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Reduces impurities in films
CompositionZn-Cu alloy (customizable)Adjusts electrical & optical properties
Diameter25 – 300 mm (custom sizes)Matches sputtering systems
Thickness3 – 10 mmAffects sputtering stability
BondingCopper / Titanium backingImproves heat transfer & target life

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Zinc Copper (Zn-Cu)Balanced conductivity & corrosion resistanceTransparent conductive & decorative coatings
Pure ZincHigh corrosion resistanceProtective coatings
Pure CopperExcellent conductivitySemiconductor interconnects
Zinc AluminumStrong adhesion & barrier propertiesArchitectural coatings

FAQ

QuestionAnswer
Can the composition of Zinc Copper Sputtering Targets be customized?Yes, Zn:Cu ratios can be tailored for specific film properties.
What bonding options are available?Targets can be bonded to copper or titanium backing plates.
What is the typical delivery time?Usually 3–4 weeks, depending on order size and customization.
How are targets packaged?Vacuum-sealed with protective foam, shipped in export-safe cartons or crates.
Which industries benefit most from this product?Semiconductor, display technology, optics, decorative coatings, and renewable energy.

Packaging

Each Zinc Copper Sputtering Target is vacuum-sealed to prevent oxidation and surface contamination. External labeling includes purity, composition, and lot numbers for quality traceability. Heavy-duty cartons or wooden crates ensure safe handling and international shipping.

Conclusion

The Zinc Copper Sputtering Target combines the strengths of zinc and copper, delivering excellent thin film properties for high-performance applications. With customizable sizes, compositions, and bonding options, it is a reliable solution for researchers and industrial manufacturers alike.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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