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Zinc Copper Sputtering Target

ST0123 Zinc Copper Sputtering Target, Zn/Cu

Chemical Formula: Zn/Cu
Catalog Number: ST0123
CAS Number: 7440-66-6 | 7440
Purity: 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Zinc Copper  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Zinc Copper (Zn/Cu) Sputtering Targets are alloy targets used for depositing functional thin films where controlled electrical conductivity, optical response, and corrosion behavior are required. By combining zinc’s reactivity and optical characteristics with copper’s excellent electrical conductivity and stability, Zn/Cu alloys enable tailored film properties for electronic, decorative, and functional coating applications.

Detailed Description

Our Zinc Copper Sputtering Targets are manufactured from high-purity zinc and copper through controlled alloying and densification processes to ensure uniform composition and stable sputtering behavior. Precise control of the Zn/Cu ratio is critical, as it directly influences film conductivity, transparency, adhesion, and environmental stability.

Compared with pure zinc targets, the addition of copper improves mechanical strength, reduces target oxidation sensitivity during handling, and enhances film durability. The optimized microstructure and high density help minimize particle generation, arcing, and uneven erosion during sputtering, supporting consistent deposition rates and film quality.

Zn/Cu Sputtering Targets are compatible with DC and RF magnetron sputtering systems, depending on alloy composition and deposition parameters. Targets can be supplied as monolithic pieces or bonded to copper or titanium backing plates to improve heat dissipation and extend target service life in high-power sputtering processes. A wide range of standard and custom sizes is available to match different cathode designs.

Applications

Zinc Copper Sputtering Targets are commonly used in:

  • Functional and decorative thin-film coatings

  • Electronic and microelectronic thin films

  • Optical and reflective coatings

  • Corrosion-resistant and protective layers

  • Research and development of alloy thin films

They are particularly suitable for applications requiring balanced conductivity, adhesion, and tunable optical properties.

Technical Parameters

ParameterTypical Value / RangeImportance
CompositionZn/Cu alloy (custom ratios)Controls electrical and optical film properties
Purity99.9% – 99.99%Minimizes contamination in deposited films
ShapeRound / Rectangular / CustomFits various sputtering cathodes
Density≥ 99% theoreticalEnsures stable sputtering and uniform erosion
BondingIndium, elastomer, or monolithicImproves thermal transfer and reliability
Backing PlateCopper or Titanium (optional)Enhances cooling and mechanical stability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Zinc Copper Sputtering TargetTunable conductivity and durabilityFunctional & decorative coatings
Pure Zinc TargetHigh reactivity, simple compositionProtective and sacrificial coatings
Pure Copper TargetVery high conductivityMetallization and conductive layers

FAQ

QuestionAnswer
Can the Zn/Cu ratio be customized?Yes, alloy composition can be adjusted to meet specific film requirements.
Is DC sputtering suitable?Yes, Zn/Cu targets are commonly used in DC magnetron sputtering systems.
Are bonded targets available?Yes, targets can be supplied with copper or titanium backing plates.
What sizes can you provide?Standard sizes and fully customized dimensions are available.

Packaging

Our Zinc Copper Sputtering Targets are vacuum-sealed, clearly labeled, and packed with protective materials to prevent oxidation, contamination, or mechanical damage during storage and transportation.

Conclusion

Zinc Copper Sputtering Targets provide a flexible and reliable solution for depositing alloy thin films with controlled electrical, optical, and mechanical properties. With customizable composition, high purity, and stable sputtering performance, they are well suited for both research and industrial coating applications.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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