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VD0797 Zinc Fluoride Evaporation Materials, ZnF2

Catalog No.VD0797
MaterialZinc Fluoride (ZnF2)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM stands at the forefront of producing and supplying top-tier, high-purity zinc fluoride evaporation materials. We specialize in a diverse range of evaporation materials, available in both powder and granule forms. For those with specific needs, we also offer customized material options to meet individual requirements.

MSDS File

Zinc Fluoride Evaporation Materials Overview

Zinc fluoride evaporation material, with the chemical formula ZnF2, is essential for creating high-quality deposited films. TFM is dedicated to providing evaporation materials with a purity of up to 99.9995%, ensuring exceptional performance through stringent quality assurance practices.

Zinc Fluoride Evaporation Materials Specification

Material TypeZinc Fluoride
SymbolZnF2
Appearance/ColorWhite solid
Melting Point872 °C (1,602 °F; 1,145 K) (anhydrous)
100 °C, decomposes (tetrahydrate)
Density4.95 g/cm3 (anhydrous)
2.30 g/cm3 (tetrahydrate)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

Applications

Zinc fluoride evaporation materials are vital in various deposition techniques, including:

  • Semiconductor Deposition
  • Chemical Vapor Deposition (CVD)
  • Physical Vapor Deposition (PVD)

These materials are primarily used in optics for wear protection, decorative coatings, and displays.

Packaging

Our zinc fluoride evaporation materials are carefully packaged to maintain quality and facilitate efficient handling. Each package is clearly labeled to ensure proper identification and quality control, minimizing the risk of damage during storage and transportation.

Contact Us

TFM is a leading manufacturer and supplier of high-purity zinc fluoride evaporation materials. We offer a range of shapes and forms, including tablets, granules, rods, and wires, with options for custom-made materials. We also provide evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and to inquire about materials not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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