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Zinc Nitride Evaporation Materials

VD0758 Zinc Nitride Evaporation Materials, Zn3N2

Catalog No.VD0758
MaterialZinc Nitride (Zn3N2)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top manufacturer and supplier of high-purity Zinc Nitride (Zn₃N₂) evaporation materials. We provide these materials in both powder and granule forms to suit various deposition needs. Additionally, we offer customized shapes and quantities upon request to meet specific requirements. Our commitment to quality ensures that all our evaporation materials are of the highest standards.

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Zinc Nitride Evaporation Materials Overview

TFM offers high-purity Zinc Nitride (Zn₃N₂) evaporation materials, a crucial component in the deposition of high-quality films. These nitride ceramic materials are renowned for their role in producing superior thin films due to their exceptional purity and reliability. TFM’s Zinc Nitride materials are manufactured with a purity level of up to 99.9995%, adhering to rigorous quality assurance protocols.

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Zinc Nitride Evaporation Materials Specification

Material TypeZinc Nitride
SymbolZn3N2
Appearance/ColorBlue-gray cubic crystals
Melting PointDecomposes 700°C
Density6.22 g/cm3
Purity99.9%
ShapePowder/ Granule/ Custom-made

Applications of Zinc Nitride Evaporation Materials

Zinc Nitride evaporation materials are versatile and used in:

  • Deposition Processes: Essential for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Suitable for wear protection, decorative coatings, and display technologies.

Packaging and Handling

Our Zinc Nitride evaporation materials are meticulously tagged and labeled for efficient identification and quality control. We ensure robust packaging to prevent any damage during storage and transportation.

Contact Information

TFM is a leading provider of high-purity Zinc Nitride evaporation materials, available in various forms including tablets, granules, rods, and wires. Custom shapes and quantities can be arranged upon request. We also supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and inquiries about other materials, please reach out to us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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