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VD0743 Zinc Oxide with Alumina Evaporation Materials, ZnO/Al2O3

Catalog No.VD0743
MaterialZinc Oxide with Alumina
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM is a premier manufacturer and distributor of high-purity zinc oxide with alumina evaporation materials. We provide a comprehensive range of evaporation materials in both powder and granule forms. For specialized needs, customized options are available upon request.

MSDS File

Zinc Oxide with Alumina Evaporation Materials Overview

Our zinc oxide with alumina evaporation materials, with the chemical formula ZnO/Al₂O₃, are crucial for achieving high-quality films in various deposition processes. TFM specializes in producing these materials with exceptional purity, up to 99.9995%, ensuring reliability and top performance.

Applications

Zinc oxide with alumina evaporation materials are versatile and used in:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Applied in wear protection, decorative coatings, and display technologies.

Packaging

Our zinc oxide with alumina materials are carefully tagged and labeled for efficient identification and quality control. We ensure robust packaging to prevent damage during storage and transportation.

Contact Us

TFM offers zinc oxide with alumina evaporation materials in various forms, including tablets, granules, rods, and wires. Custom forms and quantities are available upon request. In addition to these materials, we also provide evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For pricing and more details, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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