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ST0204 Zinc Oxide with Alumina Sputtering Target, ZnO/Al2O3

Chemical Formula: ZnO/Al2O3
Catalog Number: ST0204
CAS Number: 1314-13-2 | 1344
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Zinc Oxide with Alumina  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Zinc Oxide with Alumina (ZnO/Al₂O₃) sputtering targets—often associated with Al-doped ZnO (AZO) systems—are widely used to deposit transparent conductive oxide (TCO) films. These materials combine high optical transparency in the visible range with good electrical conductivity, making them a cost-effective alternative to indium-based coatings in displays, photovoltaics, and optoelectronic devices.


Detailed Description

ZnO/Al₂O₃ sputtering targets are engineered by introducing controlled amounts of alumina into a zinc oxide matrix. The presence of aluminum acts as a donor dopant, increasing carrier concentration and thereby improving electrical conductivity while maintaining high transparency.

Targets are typically fabricated via advanced ceramic processing routes such as hot pressing or sintering to achieve high density and uniform microstructure. Precise control over dopant distribution is essential to ensure stable sputtering behavior and consistent film properties across large substrates.

Compared with undoped ZnO, ZnO/Al₂O₃ targets provide significantly lower resistivity and improved film stability under thermal and environmental stress. The material is compatible with both RF and DC magnetron sputtering systems and can be supplied as planar or rotatable targets. For large-area coating applications, bonding to copper backing tubes or plates enhances thermal management and extends operational lifetime.

Key features include:

  • High transparency in the visible spectrum with improved conductivity

  • Stable electrical performance through controlled Al doping

  • Excellent environmental stability compared to ITO alternatives

  • High density and uniform microstructure for consistent sputtering

  • Customizable Al₂O₃ doping levels (typically 1–3 wt%)


Applications

ZnO/Al₂O₃ sputtering targets are widely used in:

  • Transparent conductive films for displays (LCD, OLED)

  • Thin film solar cells (as TCO layers)

  • Touch panels and smart windows

  • Low-emissivity (Low-E) glass coatings

  • Transparent electrodes in optoelectronic devices

  • Research and development in TCO materials


Technical Parameters

ParameterTypical Value / RangeImportance
CompositionZnO + Al₂O₃ (1–3 wt% Al₂O₃)Controls conductivity & transparency
Purity99.9% – 99.99%Reduces impurities affecting film quality
Density≥ 95% – 99% theoreticalEnsures stable sputtering
Diameter50 – 300 mm (custom)Compatible with sputtering systems
Thickness3 – 6 mmInfluences target lifetime
Resistivity (film)~10⁻³ – 10⁻⁴ Ω·cm (typical)Key for TCO performance
BondingCopper backing (In / elastomer)Improves heat dissipation

Comparison with Related Materials

MaterialKey AdvantageTypical Application
ZnO/Al₂O₃ (AZO)Cost-effective, stable TCODisplays, solar cells
ITO (In₂O₃:SnO₂)Excellent conductivity & transparencyHigh-end displays
ZnO (undoped)High transparency, low costOptical coatings
FTO (SnO₂:F)Good thermal stabilitySolar cells, glass coatings

FAQ

QuestionAnswer
Can the Al₂O₃ doping level be customized?Yes, typical ranges are 1–3 wt%, but can be adjusted based on required conductivity.
Is ZnO/Al₂O₃ a replacement for ITO?In many applications, it serves as a cost-effective alternative with good performance.
What sputtering method is suitable?Both RF and DC magnetron sputtering are commonly used.
Is bonding required?For high-power or large-area deposition, bonding to a copper backing plate is recommended.
What industries use this material most?Display manufacturing, photovoltaics, and optoelectronics.

Packaging

Our Zinc Oxide with Alumina Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.


Conclusion

Zinc Oxide with Alumina sputtering targets provide an efficient and scalable solution for producing transparent conductive films with excellent optical and electrical performance. With customizable doping levels and reliable manufacturing quality, they are ideal for modern display technologies, solar energy systems, and advanced optoelectronic applications.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Zinc Oxide with Alumina Sputtering Target Bonding

Specialized bonding services for Zinc Oxide with Alumina (ZnO/Al2O3) Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Order Now

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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