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ST0289 Zinc Sulfide Sputtering Target, ZnS

Chemical Formula: ZnS
Catalog Number: ST0289
CAS Number: 1314-98-3
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Zinc Sulfide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Zinc Sulfide Sputtering Target Description

A Zinc Sulfide Sputtering Target is a type of ceramic material used in sputtering processes, composed of zinc and sulfur. This target is commonly utilized in various applications, including thin-film deposition and optical coatings, due to its unique properties.

ZincZinc is a chemical element with the symbol “Zn” and an atomic number of 30. The name “zinc” is thought to originate from the German word ‘zinc,’ which may have been derived from the Persian word ‘sing,’ meaning stone. Zinc was utilized by Indian metallurgists as early as 1000 BC. It is positioned in Period 4 and Group 12 of the periodic table, belonging to the d-block of elements. The relative atomic mass of zinc is approximately 65.409 Daltons, with the number in parentheses indicating a margin of uncertainty.

Related Product: Zinc (Zn) Sputtering Target

SulfurSulfur, also spelled sulphur, is a chemical element with the symbol “S” and an atomic number of 16. The name “sulfur” originates from either the Sanskrit word ‘sulvere’ or the Latin ‘sulfurium,’ both referring to the element. Sulfur has been known and used by ancient civilizations, including the Chinese and Indians, as early as 2000 BC. It is located in Period 3 and Group 16 of the periodic table, classified under the p-block. The relative atomic mass of sulfur is approximately 32.065 Daltons, with the value in parentheses indicating a margin of uncertainty.

Zinc Sulfide Sputtering Target Specification

Compound Formula ZnS
Appearance White, Crystalline Solid
Melting Point 1,700 °C
Density 3.98 g/cm3
Bonding Method Indium, Elastomer
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Zinc Sulfide Sputtering Target Bonding Service

Specialized bonding services for  Zinc Sulfide Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Zinc Disulfide Sputtering Target Application

The Zinc Sulfide Sputtering Target is widely used for various applications, including thin film deposition, decorative coatings, and in the semiconductor and display industries. It is also utilized in the production of LED and photovoltaic devices, as well as functional coatings. In addition, this material is essential in the optical information storage industry, glass coating applications such as automotive and architectural glass, and optical communications.

Zinc Disulfide Sputtering Target Packing

Our Zinc Sulfide Sputtering Targets are carefully tagged and labeled on the exterior for easy identification and to maintain strict quality control standards. We take significant precautions to ensure these targets are handled properly, minimizing the risk of damage during both storage and transportation.

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TFM offers Zinc Sulfide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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