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Zinc Telluride Evaporation Materials

VD0871 Zinc Telluride Evaporation Materials, ZnTe

Catalog No.VD0871
MaterialZinc Telluride (ZnTe)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top-tier producer and supplier of high-purity zinc telluride and an extensive range of other evaporation materials. We provide these materials in both powder and granule forms to meet diverse needs. Additionally, we offer customized solutions to accommodate specific requirements upon request.

MSDS File

Zinc Telluride Evaporation Materials Overview

Zinc telluride (ZnTe) is a critical component in high-precision deposition processes. As a telluride ceramic material, it plays a significant role in ensuring the quality of thin films applied during various deposition techniques. At TFM, we produce zinc telluride evaporation materials with exceptional purity, reaching up to 99.9995%, thanks to our rigorous quality assurance procedures.

Specifications of Zinc Telluride Evaporation Materials

Material TypeZinc Telluride
SymbolZnTe
Appearance/ColorRed crystals
Melting Point1,295 °C; 2,363 °F; 1,568 K
Density6.34 g/cm3
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

Applications

Our zinc telluride evaporation materials are widely utilized in:

  • Semiconductor Deposition: Essential for fabricating high-quality semiconductors.
  • Chemical Vapor Deposition (CVD): Used to deposit thin films for various industrial applications.
  • Physical Vapor Deposition (PVD): Applied in the creation of thin coatings and films.
  • Optics: Ideal for wear protection, decorative coatings, and display technologies.

Packaging Information

To ensure the integrity and quality of our zinc telluride materials, we carefully package them in plastic vacuum bags. This protects them during storage and transport. Additionally, each shipment includes a Certificate of Analysis (COA) for the raw material.

Contact Us

TFM is dedicated to delivering high-purity zinc telluride evaporation materials suited for diverse applications including semiconductors, CVD, PVD, and optics. Our commitment to quality is backed by our advanced engineering, manufacturing, and analytical capabilities. For inquiries or more information, reach out to us today.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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