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Zirconia Ceramic Substrate

Zirconia Ceramic Substrate (ZrO2)

MSDS File

Zirconia Ceramic Substrate

Zirconia ceramic substrates are high-performance materials known for their exceptional strength, wear resistance, and thermal stability. These substrates are primarily composed of zirconium dioxide (ZrO₂), which provides superior mechanical properties compared to other ceramic materials.

Key Features

  • High Strength and Toughness – Zirconia ceramics exhibit outstanding mechanical strength and fracture toughness, making them ideal for demanding applications.

  • Excellent Wear Resistance – The high hardness of zirconia ensures minimal wear and long service life in abrasive environments.

  • Thermal and Chemical Stability – These substrates can withstand high temperatures and resist corrosion from acids, alkalis, and harsh chemicals.

  • Low Thermal Conductivity – Unlike other ceramics, zirconia has low thermal conductivity, providing excellent insulation properties.

  • Electrical Insulation – With a high dielectric strength, zirconia ceramic substrates are widely used in electronic and semiconductor applications.

Applications

  • Electronics and Semiconductor – Used as insulating layers and heat-resistant components in electronic circuits.

  • Medical Devices – Utilized in dental implants, prosthetics, and surgical tools due to their biocompatibility.

  • Aerospace and Automotive – Applied in high-performance engine components, fuel cells, and sensors.

  • Industrial Machinery – Suitable for wear-resistant parts, cutting tools, and high-precision manufacturing processes.

Physical Properties of Zirconia Ceramic Substrate

PropertyValue
MaterialZrO₂
StructureCubic
Density (g/cm³)6.27
Sintering Temperature (℃)2370

Specifications

  • Standard Size: 100 x 100 x 1.0 mm
  • Customization: Sizes available upon request
  • Polish Options: SSP or DSP

Zirconia ceramic substrates are ideal for applications requiring high durability, thermal stability, and reliable performance under extreme conditions.

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FAQ

A thin film substrate is the base material upon which thin layers of materials are deposited to create electronic, optical, or mechanical devices. The substrate provides structural support and can influence the properties of the thin film.

The choice of substrate affects the film’s structural integrity, electrical properties, and overall performance. Factors like thermal expansion coefficient, surface smoothness, and chemical compatibility are crucial considerations.

Materials such as lanthanum aluminate (LaAlO₃), magnesium oxide (MgO), and strontium titanate (SrTiO₃) are commonly used due to their lattice compatibility and thermal stability, which are essential for optimal superconducting properties.

Metal substrates offer high electrical and thermal conductivity, making them suitable for applications requiring efficient heat dissipation and electrical connectivity. However, their surface properties and potential for oxidation must be managed during deposition.

These substrates are materials that can support the growth of thin films exhibiting magnetic or ferroelectric properties, essential for applications in memory devices, sensors, and actuators.

Semiconductor substrates, such as silicon wafers, serve as the foundation for integrated circuits and various electronic components, providing the necessary electrical characteristics and structural support for device fabrication.

Gallium Nitride (GaN) substrates are pivotal for high-performance optoelectronic and power devices due to their excellent thermal conductivity, high breakdown voltage, and efficiency. They are widely used in LEDs, power transistors, and RF components.

Halide crystal substrates, composed of halide compounds, are utilized in specialized optical applications, including infrared spectroscopy and laser systems, due to their unique optical properties.
Ceramic substrates provide high thermal stability, mechanical strength, and electrical insulation, making them ideal for high-frequency and high-power applications.
Proper surface preparation, including cleaning and polishing, ensures the removal of contaminants and surface irregularities, leading to improved film adhesion, uniformity, and performance.
Yes, thin films can be deposited on flexible substrates like polymers, enabling the development of flexible electronics and wearable devices. However, challenges include managing mechanical stress and ensuring film adhesion.
Challenges include ensuring lattice matching to minimize defects, managing thermal expansion differences to prevent stress and delamination, and achieving desired electrical and optical properties for specific applications.
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