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Zirconium Aluminum Sputtering Target, Zr/Al

Chemical Formula: Zr/Al
Catalog Number: TFM-SPT-0695
CAS Number: 7440-67-7 | 7429
Purity: 99.5%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Zirconium Aluminum sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Product Overview

Zirconium Aluminum Sputtering Target (Zr/Al) is an alloy sputtering target used to deposit composition-controlled alloy films. Relative to a pure elemental target, the alloying constituents are introduced to tune electrical, magnetic, optical, mechanical, or adhesion-related film properties. For this reason, alloy ratio, homogeneity, purity basis, and the intended film composition should be defined clearly in the procurement specification.

Material and Deposition Characteristics

Many alloy targets are electrically conductive and can be compatible with DC or pulsed-DC magnetron sputtering, subject to the actual alloy composition and equipment capability. The target composition is not always reproduced exactly in the deposited film because preferential sputtering, re-sputtering, substrate heating, and process gas conditions can shift the final ratio. For composition-sensitive work, deposited-film analysis should be part of process qualification.

Technical Data

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Ensures stable alloy composition and film quality
CompositionZr/Al ratios customizable (e.g., 70/30, 50/50)Determines coating performance
Diameter25 – 300 mm (custom)Compatible with standard sputtering systems
Thickness3 – 6 mmInfluences sputtering efficiency and target lifespan
Density≥ 99% theoretical densityImproves sputtering stability and film uniformity
BondingCopper backing plate / Indium bondedEnhances heat dissipation during sputtering
MaterialKey AdvantageTypical Application
Zirconium Aluminum (Zr/Al)Excellent corrosion and oxidation resistanceProtective and functional coatings
Zirconium (Zr)High corrosion resistanceStructural and protective coatings
Aluminum (Al)Lightweight with good oxidation resistanceConductive and protective coatings
QuestionAnswer
Can the Zr/Al composition be customized?Yes. The zirconium-to-aluminum ratio can be adjusted depending on the required coating properties.
What sputtering methods are suitable for Zr/Al targets?Zr/Al sputtering targets are commonly used in DC magnetron sputtering and other PVD deposition systems.
Are bonded sputtering targets available?Yes. Copper backing plates with indium bonding are often supplied to improve heat dissipation during sputtering.
What purity levels are typically available?Standard purities typically range from 99.9% to 99.99%.
What substrates can Zr/Al films be deposited on?Zr/Al films can be deposited on metals, silicon wafers, glass, ceramics, and other substrates.

Typical Thin-Film Applications

  • Zirconium Aluminum alloy films where composition control is important to electrical, mechanical, magnetic, or optical performance
  • Multilayer stacks, adhesion/barrier layers, conductive films, or functional coatings depending on the alloy system
  • Research and production programs that require customized alloy ratios and repeatable sputtering behavior

Target Configuration and Ordering Considerations

For quotation and manufacturability review, provide target size, thickness, purity or alloy composition, quantity, and the sputtering gun or cathode model if known. If a bonded assembly is required, include backing-plate material, bonding preference, and any dimensional tolerances, surface-finish needs, or inspection-document requirements. TFM can also review customer drawings or old-target samples for replacement builds.

Frequently Asked Questions

Can the composition of a Zirconium Aluminum sputtering target be customized?

Yes. For alloy targets, the required ratio should be specified clearly in wt% or at%. TFM can review custom compositions together with purity, dimensions, and manufacturability.

Will an alloy target always produce a film with the same composition?

Not necessarily. Preferential sputtering, substrate heating, process gas, and re-sputtering effects can shift the deposited composition relative to the nominal target chemistry. Film analysis should be used when the composition is critical.

Is a Zirconium Aluminum alloy target compatible with DC magnetron sputtering?

Many metallic alloy targets are electrically conductive and can be compatible with DC or pulsed-DC sputtering, but the final choice depends on the actual alloy system and equipment.

Why is alloy homogeneity important in a Zirconium Aluminum target?

A uniform alloy distribution helps support stable erosion and reduces local composition variation across the target, which in turn helps improve run-to-run consistency.

Can a Zirconium Aluminum target be supplied bonded?

Yes. Where the cathode or thermal load requires it, TFM can supply bonded assemblies. Backing-plate material, target thickness, bonding method, and operating power should be reviewed together.

What should I include in an RFQ for Zirconium Aluminum?

Specify the alloy composition, purity basis, dimensions, quantity, backing requirement, cathode model or drawing, and any tolerance, inspection, or documentation requirements.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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