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VD0592 Zirconium Evaporation Materials, Zr

Material Type：Zirconium
Symbol：Zr
Color/Appearance：Silvery White, Metallic
Purity：99% ~ 99.5%
Shape：Powder/ Granule/ Custom-made

TFM is a top manufacturer and supplier of high-purity Zirconium Evaporation Materials, along with a broad range of other evaporation materials. We provide these materials in both powder and granule forms, with options for custom specifications available to meet your unique needs.

MSDS File

Zirconium Evaporation Materials Overview

Zirconium is a metal known for its high melting point and light gray hue. Its surface easily forms a lustrous oxide layer, giving it a steel-like appearance. With excellent corrosion resistance, zirconium is soluble in hydrofluoric acid and aqua regia. When exposed to high temperatures, zirconium can react with both non-metallic and various metal elements, forming solid solutions.

High-purity zirconium evaporation materials are crucial in deposition processes to achieve high-quality films. TFM specializes in producing zirconium evaporation materials with up to 99.5% purity, backed by stringent quality assurance procedures to ensure consistent product performance.

Zirconium Evaporation Materials Specification

Material TypeZirconium
SymbolZr
Melting Point1,852 °C
Color/AppearanceSilvery White, Metallic
Theoretical Density6.49 g/cc
Thermal Conductivity17.2 W/m.K
SynonymsZirconium Pellets, Zirconium Pieces, Zirconium Evaporation Pellet, Zr Pellets, Zr Pieces, Zr Evaporation Pellet

Applications of Zirconium Evaporation Materials

  • Deposition Processes: Utilized in semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Applied in wear protection, decorative coatings, and display technologies.

Packaging and Handling

Our zirconium evaporation materials are meticulously handled to prevent damage during storage and transportation, ensuring that the products maintain their original high quality.

Contact Us

TFM offers zirconium evaporation materials in various forms, purities, sizes, and price points. We specialize in producing high-purity e-beam evaporation materials with maximum density and minimal grain sizes. For current pricing on zirconium pellets and other deposition materials, please reach out with an inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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