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ST0206 Zirconium Oxide Sputtering Target, Zirconia ZrO2

Chemical Formula: ZrO2
Catalog Number: ST0206
CAS Number: 1314-23-4
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Zirconium Oxide  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Zirconium Oxide Sputtering Target Description

zirconia structure
zirconia structure

Zirconium oxide sputtering targets from TFM, also known as zirconia sputtering targets, are composed of zirconium (Zr) and oxygen (O). Zirconium dioxide (ZrO2) is typically found in a white crystalline form and is naturally occurring as the mineral baddeleyite, which has a monoclinic crystalline structure. Additionally, cubic zirconia, a synthetic material stabilized by dopants and known for its cubic structure, is produced in various colors and commonly used as a gemstone or diamond simulant.

Zirconium oxide (ZrO2) exists in three distinct phases depending on temperature: monoclinic below 1170°C, tetragonal between 1170°C and 2370°C, and cubic above 2370°C. The higher the temperature, the higher the symmetry of the crystal structure, which is a common characteristic in phase transitions. A small addition of calcium or yttrium oxides can stabilize zirconia in the cubic phase even at lower temperatures. This stabilized form is often used in various applications, including gemstones like cubic zirconia. Unlike titanium dioxide (TiO2), which has titanium in a six-coordinated state across all its phases, monoclinic zirconia features zirconium in a seven-coordinated arrangement. This is due to the relatively larger atomic size of zirconium compared to titanium.

Zirconium Oxide Sputtering Target Specification

Material TypeZirconium Oxide
SymbolZrO2
Color/AppearanceWhite, Solid
Melting Point (°C)~2,700
heoretical Density (g/cc)5.89
SputterRF, RF-R
Type of BondIndium, Elastomer
CommentsFilms oxygen deficient, clear and hard.

Zirconium Oxide Sputtering Target Application

Zirconium oxide, commonly known as zirconia, is widely used in producing hard ceramics, particularly in dental applications. Its uses extend to being a protective coating on titanium dioxide pigments, serving as a refractory material, and as a thin film coating material. Additionally, zirconia is utilized in insulation, fuel cells, abrasives, and enamels. Zirconia sputtering targets are often employed for thin film deposition, which is crucial in applications such as fuel cells, decoration, semiconductors, displays, LEDs, photovoltaic devices, and glass coatings.

Stabilized zirconia is particularly valuable in oxygen sensors and fuel cell membranes due to its high ionic conductivity, allowing oxygen ions to move freely through its crystal structure at elevated temperatures. This property, coupled with its low electronic conductivity, makes zirconia an essential material in the field of electroceramics. It is also used as a solid electrolyte in electrochromic devices. Additionally, zirconia serves as a precursor in producing lead zirconate titanate (PZT), a high dielectric constant material utilized in various electronic components.

Zirconium Oxide Sputtering Target Bonding

Specialized bonding services for Zirconium Oxide  Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Packaging

Our zirconium oxide sputter targets are meticulously tagged and labeled externally to facilitate easy identification and ensure strict quality control. We take extensive precautions to prevent any potential damage during storage or transportation, thereby preserving the integrity and quality of our products.

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TFM offers Zirconium Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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