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ST0127 Zirconium Titanium Sputtering Target, Zr/Ti

Chemical Formula: Zr/Ti
Catalog Number: ST0127
CAS Number: 50646-37-2
Purity: 99.5%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Zirconium Titanium  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Zirconium Titanium Sputtering Target Description

The Zirconium Titanium Sputtering Target from TFM is an alloy sputtering material composed of Zr and Ti.

ZirconiumZirconium, a chemical element, derives its name from the Persian word ‘zargun,’ meaning ‘gold colored.’ It was first mentioned in 1789 by H. Klaproth, who observed it, and later isolated and announced by J. Berzelius. The chemical symbol for zirconium is “Zr,” and it has an atomic number of 40. Zirconium is located in Period 5, Group 4 of the periodic table, within the d-block. Its relative atomic mass is 91.224(2) Dalton, with the number in parentheses indicating the uncertainty of this value.

Related Product: Zirconium (Zr) Sputtering Target

TitaniumTitanium is a chemical element that originated from Titans, the sons of the Earth goddess of Greek mythology. It was first mentioned in 1791 and observed by W. Gregor. The isolation was later accomplished and announced by J. Berzelius. “Ti” is the canonical chemical symbol of titanium. Its atomic number in the periodic table of elements is 22 with a location at Period 4 and Group 4, belonging to the d-block. The relative atomic mass of titanium is 47.867(1) Dalton, the number in the brackets indicating the uncertainty.

Related Product: Titanium (Ti) Sputtering Target

Zirconium Titanium Sputtering Target Application

The Zirconium Titanium Sputtering Target is widely employed for thin film deposition and decorative coatings. It is crucial in the semiconductor industry, display technology, LED and photovoltaic devices, and functional coatings. Additionally, it serves various sectors such as optical information storage, glass coating for automotive and architectural applications, and optical communication systems, among others.

Zirconium Titanium Sputtering Target Packing

Our Zirconium Titanium Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and stringent quality control. We take great care to prevent any damage during storage and transportation, maintaining the highest standards of product integrity upon delivery.

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TFM offers Zirconium Titanium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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