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Zirconium Yttrium Sputtering Target

ST0512 Zirconium Yttrium Sputtering Target, Zr/Y

Chemical Formula: Zr/Y
Catalog Number: ST0512
Purity: 99%~99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Zirconium Yttrium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Zirconium Yttrium Sputtering Target Description

Explore the Exceptional Properties of Zirconium Yttrium Sputtering Targets and uncover their transformative applications across diverse industries. This page highlights the unique attributes of integrating Zirconium and Yttrium in thin film deposition processes, revealing a path to innovation.

Zirconium: Robust and Resilient

Zirconium, symbolized by Zr with atomic number 40, is a robust transition metal with a grey-white luster. Resembling hafnium and titanium, it serves as a refractory and opacifier, showcasing excellent corrosion resistance. Zirconium is used as an alloying agent and in compounds such as zirconium dioxide and zirconocene dichloride.

Yttrium: Elegance in Element

Yttrium, symbolized by Y, is a chemical element first identified in 1794 by J. Gadolin and isolated by G. Mosander. With an atomic number of 39, it is located in Period 5, Group 3 of the periodic table, and belongs to the d-block. Yttrium has a relative atomic mass of 88.90585(2) Dalton.

Related Products: Zirconium Sputtering Target, Yttrium Sputtering Target.

Zirconium Yttrium Sputtering Target Specifications

SpecificationDetails
Material TypeZirconium Yttrium
SymbolZr/Y
Color/AppearanceSolid
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″ <br> Thick: 0.125″, 0.250″ <br> Custom shapes and sizes available on inquiry.
PackingTargets are tagged and labeled externally for identification and quality control. Careful handling during storage and transportation.

Zirconium Yttrium Sputtering Target Applications

Elevated Thin Film Deposition: Zirconium Yttrium sputtering targets are essential for advanced thin film creation, ensuring precision and quality.

Synergy of Elements: The blend of Zirconium and Yttrium enhances material strength and versatility, opening new possibilities.

Driving Progress: This combination fuels innovation across industries, from semiconductors to optics.

Zirconium Yttrium Sputtering Target Advantages

Robust Resilience: The combination of Zirconium’s strength and Yttrium’s elegance results in exceptionally durable thin films, ensuring long-term performance.

Diverse Applications: From advanced displays to semiconductor processes, Zirconium Yttrium sputtering targets showcase their versatility across various industries.

Catalyst for Innovation: Integrating these elements drives progress in cutting-edge technologies across multiple sectors.

Harness the potential of Zirconium Yttrium Sputtering Targets and explore their unique properties for groundbreaking applications. Contact us today for customized solutions that propel your innovation forward.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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