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VD0667B ZnIn2Te4 Pellet Evaporation Material

MSDS File
Material TypeZnIn2Te4
SymbolZnIn2Te4
Melting Point (°C)
Theoretical Density (g/cc)
Z Ratio
E-Beam
E-Beam Crucible Liner Material
Temp. (°C) for Given Vap. Press. (Torr)
Comments

ZnIn2Te4 Pellet Evaporation Material

TFM offers high-quality ZnIn2Te4 (Zinc Indium Telluride) pellet evaporation material, designed for thin-film deposition in advanced semiconductor and optoelectronic applications. The ZnIn2Te4 alloy, composed of zinc (Zn), indium (In), and tellurium (Te), is known for its excellent optoelectronic properties and wide bandgap, making it ideal for use in infrared detectors, photodetectors, and solar cells.

The evaporation process using ZnIn2Te4 pellets ensures high purity and uniformity in the deposition of thin films. These films are widely used in the manufacturing of infrared detectors, high-efficiency solar cells, and light-emitting diodes (LEDs), owing to their exceptional electrical and optical characteristics. The wide bandgap of ZnIn2Te4 enhances its performance in high-temperature and high-radiation environments, making it ideal for use in space technology, military applications, and medical imaging systems.

In addition, ZnIn2Te4 thin films are used in advanced solar cell technologies, where their high carrier mobility and low recombination rates contribute to enhanced energy conversion efficiency. These films also have promising applications in infrared light-emitting devices, where the tunable optical properties allow for customizable wavelength output, crucial for advanced lighting solutions and sensor technologies.

TFM provides customized ZnIn2Te4 pellet evaporation materials to meet the specific needs of high-performance thin-film deposition. With precise control over composition and purity, our pellets ensure optimal evaporation performance and uniform deposition in a range of applications, including infrared detection, optoelectronics, and solar energy technologies.

The density of ZnIn2Te4 pellet evaporation material typically ranges from 7.2 to 7.6 g/cm³, providing excellent thermal stability and mechanical strength during deposition. This density ensures that ZnIn2Te4 films maintain high structural integrity, making them suitable for reliable performance in high-tech applications.

TFM’s ZnIn2Te4 pellet evaporation materials are produced to the highest standards, offering superior material quality, low impurity levels, and optimized evaporation characteristics. TFM’s materials are ideal for advanced thin-film applications in semiconductors, optoelectronics, and renewable energy systems.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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