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CIGS(CuInxGa1-xSe2) Pellet Evaporation Material

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CIGS (CuInₓGa₁₋ₓSe₂) Pellet Evaporation Material

Introduction

CIGS (Copper Indium Gallium Selenide, CuInₓGa₁₋ₓSe₂) pellet evaporation material is a crucial compound source for thin film deposition, particularly in the fabrication of high-efficiency photovoltaic devices. By tuning the indium-to-gallium ratio (ₓ), researchers and manufacturers can optimize bandgap properties, enabling superior performance in solar cells, optoelectronic devices, and advanced coating applications.

Detailed Description

CIGS evaporation materials are engineered in the form of dense, uniform pellets, ensuring stable evaporation behavior under vacuum deposition conditions. Produced from high-purity precursors (≥99.9%), these pellets maintain consistent stoichiometry, which is essential for achieving reproducible thin film compositions.

Key features include:

  • Bandgap Tunability (1.0–1.7 eV) – adjustable by varying the In/Ga ratio, optimizing solar absorption efficiency.

  • High Purity – minimizes impurities and enhances thin film performance.

  • Pellet Form Factor – allows easy handling and stable evaporation in e-beam and thermal evaporation systems.

  • Uniform Stoichiometry – ensures reproducible deposition results across different production runs.

  • Versatility – suitable for both research and industrial-scale thin film solar cell manufacturing.

Applications

CIGS evaporation materials are widely used in:

  • Photovoltaics – thin film solar cell absorber layers.

  • Optoelectronics – devices requiring tunable bandgaps and high absorption coefficients.

  • R&D – semiconductor research in renewable energy and electronic materials.

  • Thin Film Coatings – functional coatings in energy and optical industries.

  • Pilot & Production Lines – scalable deposition processes for CIGS solar modules.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Ensures minimal contamination
CompositionCuInₓGa₁₋ₓSe₂ (ₓ adjustable 0–1)Bandgap control for solar efficiency
FormPelletStable for evaporation sources
Particle Size3 – 12 mm (customizable)Matches crucible/e-beam needs
Bandgap Range1.0 – 1.7 eVOptimized for photovoltaic applications

Comparison with Related Materials

MaterialKey AdvantageTypical Application
CIGS (CuInₓGa₁₋ₓSe₂)Tunable bandgap, high efficiencyThin film solar cells
CIS (CuInSe₂)Narrow bandgap (~1.0 eV)Low-bandgap PV, R&D
CGS (CuGaSe₂)Wider bandgap (~1.7 eV)Tandem PV, optoelectronics

FAQ

QuestionAnswer
Can the In/Ga ratio be customized?Yes, the composition can be tailored to achieve desired bandgaps.
What deposition methods are suitable?Both e-beam evaporation and thermal evaporation are applicable.
Is this material used in commercial solar modules?Yes, CIGS is one of the leading thin film absorber materials in industry.
How is it packaged?Vacuum-sealed in moisture-protected containers, shipped in export-safe cartons or wooden crates.
What industries benefit most?Photovoltaic manufacturing, optoelectronics, and semiconductor research.

Packaging

Each batch of CIGS pellets is vacuum-sealed with protective inert gas to prevent oxidation. Packaging includes anti-static bags, foam cushioning, and export-grade cartons or wooden crates, ensuring safe delivery and long-term storage stability.

Conclusion

CIGS (CuInₓGa₁₋ₓSe₂) pellet evaporation material offers a tunable and high-efficiency solution for thin film solar cells and advanced optoelectronic applications. With high purity, stable pellet form, and customizable composition, it remains a leading choice for both research and industrial-scale production.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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