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CIGS(CuInxGa1-xSe2) Pellet Evaporation Material

MSDS File
Material TypeCIGS(CuInxGa1-xSe2)
SymbolCIGS(CuInxGa1-xSe2)
Melting Point (°C)
Theoretical Density (g/cc)
Z Ratio
E-Beam
E-Beam Crucible Liner Material
Temp. (°C) for Given Vap. Press. (Torr)
Comments

CIGS(CuInxGa1-xSe2) Pellet Evaporation Material

TFM offers high-purity CIGS(CuInxGa1-xSe2) Pellet Evaporation Material, a crucial compound for thin-film solar cells, semiconductor applications, and optoelectronic devices. Known for its high efficiency and excellent photovoltaic properties, CIGS is widely used in solar energy conversion and advanced thin-film deposition technologies.

Key Features and Advantages

  • High Purity (99.99% – 99.999%) – Ensures optimal performance in thin-film deposition.

  • Superior Light Absorption – Provides high conversion efficiency for solar energy applications.

  • Optimized for Thin-Film Deposition – Ideal for thermal and E-beam evaporation techniques.

  • Customizable Composition – The Cu/In/Ga ratio can be modified to adjust bandgap energy for specific applications.

  • Stable & Uniform Film Formation – Ensures consistent coating quality, essential for photovoltaic devices.

Applications

  • Thin-Film Solar Cells – A key material in flexible and high-efficiency solar panels.

  • Optoelectronic Devices – Applied in photodetectors, LEDs, and other semiconductor technologies.

  • Photovoltaic Research & Development – Supports next-generation solar cell innovation.

  • Thin-Film Transistors & Sensors – Used in wearable and transparent electronics.

Industry Impact

TFM’s CIGS(CuInxGa1-xSe2) Pellet Evaporation Material is a high-performance material for solar energy and semiconductor advancements. With its exceptional purity, superior absorption properties, and optimized thin-film deposition characteristics, it ensures high energy conversion efficiency, making it a preferred choice in renewable energy and advanced electronics.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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