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ST0009 Chromium Sputtering Target, Cr

Chemical Formula: Cr
Catalog Number: ST0009
CAS Number: 7440-47-3
Purity: 99.9%, 99.95%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Chromium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

 

 

Introduction

Chromium (Cr) is a widely used transition metal in thin film deposition, valued for its excellent adhesion, corrosion resistance, and stable oxide formation. Chromium Sputtering Targets are essential materials in physical vapor deposition (PVD) processes, where they serve as adhesion layers, functional coatings, or protective films. Their reliability and versatility make them indispensable in semiconductor, optical, and decorative coating industries.

Detailed Description

Chromium Sputtering Targets are manufactured from high-purity chromium metal through advanced metallurgical processes such as vacuum melting, forging, and precision machining. The resulting targets exhibit a dense microstructure and uniform grain distribution, which are critical for stable sputtering performance and consistent film deposition.

Chromium is particularly known for its strong adhesion to a wide range of substrates, including glass, ceramics, and polymers. This makes it an ideal interlayer material in multilayer thin film systems. Additionally, chromium forms a thin, stable oxide layer (Cr₂O₃) that enhances corrosion resistance without compromising underlying material properties.

Targets are available in planar or rotatable configurations and can be supplied as monolithic or bonded assemblies (e.g., with copper backing plates) to improve heat dissipation during sputtering. High-purity chromium minimizes particle generation and arcing, ensuring smooth film growth and improved coating uniformity.

The physical properties of chromium, including moderate sputtering yield and high melting point (~1907°C), allow for controlled deposition rates and long target life, even under high-power sputtering conditions.

Applications

Chromium Sputtering Targets are widely used in:

  • Adhesion layers in semiconductor and microelectronic devices
  • Optical coatings, including mirrors and anti-reflective layers
  • Decorative coatings for consumer products and automotive components
  • Hard, wear-resistant coatings for tools and mechanical parts
  • Thin film resistors and conductive layers
  • Glass coating for architectural and automotive applications

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99% (3N – 4N)Ensures film consistency and reduces contamination
Density≥ 99% theoreticalImproves sputtering stability and target lifetime
Diameter25 – 300 mm (custom available)Compatible with sputtering systems
Thickness3 – 6 mmInfluences sputtering rate and durability
BondingCopper backing / Indium bondingEnhances heat transfer and mechanical stability
Grain StructureFine, uniformReduces arcing and particle generation

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Chromium (Cr)Excellent adhesion, corrosion resistanceAdhesion layers, protective coatings
Titanium (Ti)Strong bonding to substratesAdhesion and barrier layers
Nickel (Ni)Good conductivity and ductilityFunctional and decorative coatings

FAQ

QuestionAnswer
Can Chromium Sputtering Targets be customized?Yes, dimensions, purity levels, and bonding types can be tailored to specific systems.
What sputtering methods are suitable for chromium?Both DC and RF magnetron sputtering are commonly used.
Why is chromium used as an adhesion layer?It forms strong bonds with various substrates and enhances coating durability.
Are bonded targets necessary?For high-power applications, bonded targets improve heat dissipation and reduce stress.
Which industries use chromium sputtering targets most?Semiconductor, optics, automotive, and decorative coating industries.

Packaging

Our Chromium Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.

Conclusion

Chromium Sputtering Targets offer a reliable and versatile solution for thin film deposition, combining strong adhesion, corrosion resistance, and stable performance. With customizable specifications and high manufacturing quality, they are well-suited for a wide range of industrial and research applications.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Order Now

Cr 99.95%, 1.00" Dia. × 0.125" Thick ST0009-01, Cr 99.95%, 1.00" Dia. × 0.250" Thick ST0009-02, Cr 99.95%, 2.00" Dia. × 0.125" Thick ST0009-03, Cr 99.95%, 2.00" Dia. × 0.250" Thick ST0009-04, Cr 99.95%, 2.00" Dia. × 0.250" Thick (U.S. Gun) ST0009-05, Cr 99.95%, 2.00" Dia. × 0.250" Thick (TORUS Mag Keeper 2) ST0009-06, Cr 99.95%, 3.00" Dia. × 0.125" Thick ST0009-07, Cr 99.95%, 3.00" Dia. × 0.250" Thick ST0009-08, Cr 99.95%, 3.00" Dia. × 0.250" Thick (U.S. Gun) ST0009-09, Cr 99.95%, 3.00" Dia. × 0.250" Thick (TORUS Mag Keeper 3) ST0009-10, Cr 99.95%, 4.00" Dia. × 0.125" Thick ST0009-11, Cr 99.95%, 4.00" Dia. × 0.250" Thick ST0009-12, Cr 99.95%, 4.00" Dia. × 0.250" Thick (U.S. Gun) ST0009-13, Cr 99.95%, 4.00" Dia. × 0.250" Thick (TORUS Mag Keeper 4) ST0009-14, Cr 99.95%, 54 mm Dia. × 1 mm Thick ST0009-15, Cr 99.95%, 57 mm Dia. × 1 mm Thick ST0009-16, Cr 99.95%, 6.00" Dia. × 0.125" Thick ST0009-17, Cr 99.95%, 6.00" Dia. × 0.250" Thick ST0009-18, Cr 99.95%, 8.00" Dia. × 0.125" Thick ST0009-19, Cr 99.95%, 8.00" Dia. × 0.250" Thick ST0009-20, Cr TRG 3N6 402×131×16mm 360pcs

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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