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Lanthanum Sputtering Target

ST0024 Lanthanum Sputtering Target, La

Chemical Formula: La
Catalog Number: ST0024
CAS Number: 7439-91-0
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lanthanum sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Lanthanum Sputtering Target (La) is a high-purity rare earth metal target used in advanced thin-film deposition processes where precise compositional control and functional material performance are required. As a highly reactive lanthanide element, lanthanum plays an important role in optical coatings, electronic materials, functional oxides, and energy-related thin films. Lanthanum sputtering targets are widely applied in research laboratories and pilot-scale production environments focused on next-generation electronic and optical technologies.

Detailed Description

Lanthanum sputtering targets are manufactured from refined, high-purity lanthanum metal using controlled melting, forming, and precision machining processes. Due to lanthanum’s strong affinity for oxygen and moisture, production and handling are carefully managed to minimize surface oxidation and impurity pickup. Finished targets exhibit uniform composition, stable density, and consistent microstructure—essential for predictable sputtering behavior.

In magnetron sputtering processes, lanthanum is commonly used as a metallic film, an alloying element, or as a precursor for lanthanum-based oxide films through reactive sputtering. Control of deposition parameters such as base pressure, oxygen partial pressure, and substrate temperature allows tuning of film properties including dielectric constant, optical refractive index, and chemical stability.

Lanthanum sputtering targets are available in monolithic form or bonded to metallic backing plates (such as copper or titanium) to improve thermal conductivity and mechanical stability during higher-power sputtering operations.

Applications

Lanthanum sputtering targets are widely used in:

  • Optical coatings and high-index thin films

  • Lanthanum oxide (La₂O₃) thin films via reactive sputtering

  • Semiconductor and microelectronic device research

  • Dielectric and high-k material development

  • Energy storage and fuel cell material research

  • Functional oxide and catalytic coatings

  • Academic and industrial thin-film R&D

Technical Parameters

ParameterTypical Value / RangeImportance
MaterialLanthanum (La)Rare earth functional metal
Purity99.9% – 99.99%Ensures film consistency
Target Diameter25 – 300 mm (custom)Fits standard sputtering guns
Thickness3 – 6 mm (custom available)Affects sputtering stability
Density≥ 99% of theoreticalPromotes uniform erosion
Backing PlateOptional (Cu / Ti)Improves heat dissipation
Deposition MethodDC / RF Magnetron SputteringProcess flexibility

Comparison with Related Rare Earth Targets

MaterialKey AdvantageTypical Application
Lanthanum (La)High reactivity, oxide formationOptical & dielectric films
Cerium (Ce)Redox activityCatalytic coatings
Yttrium (Y)Thermal stabilityOptical & protective films
Neodymium (Nd)Magnetic contributionFunctional magnetic films

FAQ

QuestionAnswer
Is lanthanum suitable for reactive sputtering?Yes, lanthanum is commonly sputtered with oxygen to form La₂O₃ films.
Does lanthanum oxidize easily?Yes, vacuum sealing and controlled handling are essential to maintain purity.
Is bonding recommended?Bonded targets are recommended for larger sizes or higher power densities.
Can small R&D targets be supplied?Yes, laboratory-scale targets are available.
How is the target packaged?Vacuum-sealed with protective materials to prevent oxidation.

Packaging

Our Lanthanum Sputtering Targets are meticulously vacuum-sealed and externally labeled to ensure accurate identification and strict quality control. Protective cushioning and moisture-resistant packaging are used to prevent oxidation or mechanical damage during storage and international transportation.

Conclusion

The Lanthanum Sputtering Target (La) is a reliable material choice for depositing rare-earth-based metallic and oxide thin films with controlled optical, electrical, and chemical properties. With high purity, customizable dimensions, and stable sputtering performance, lanthanum targets support advanced research and emerging thin-film technologies.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Order Now

La 3N ø50.8*3.18mm, La 3N ø50.8*3mm, La Target 3N ø71*3.3mm with ø76.2*3mm Cu B/Plate, La target 3N ø100×3mm (±0.1mm) Packed under Oil, La foil 0.1×25×25 mm 10 pcs, La target 3N ø4"×6mm, La target 3N ø50.8×3.18 mm, La target 3N Ø2"×3 mm, La Foil 3N 20×20 mm × 0.1 mm, La Foil 3N 20×20 mm × 0.2 mm, La Foil 3N 20×20 mm × 0.254 mm, La Foil 3N 20×20 mm × 0.5 mm, La TRG 2N5, Ø152×5 mm / Ø140×3 mm, Bonded to Ø152×4 mm Cu BP

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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