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ST0055 Vanadium Sputtering Target, V

Chemical Formula: V
Catalog Number: ST0055
CAS Number: 7440-62-2
Purity: 99.5%, 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Vanadium  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Vanadium Sputtering Target Description

The vanadium sputtering target shares properties with its source material. Vanadium is a hard, silvery-grey, malleable transition metal that naturally occurs in about 65 minerals and fossil fuel deposits. It is primarily produced in China and Russia from steel smelter slag, while other countries obtain it from magnetite directly, flue dust of heavy oil, or as a byproduct of uranium mining. Vanadium is mainly used to produce specialty steel alloys such as high-speed tool steels. The most important industrial vanadium compound, vanadium pentoxide, is used as a catalyst for the production of sulfuric acid. Additionally, the vanadium redox battery for energy storage may become an important application in the future.

Vanadium Sputtering Target Specification

Material TypeVanadium
SymbolV
Color/AppearanceSilvery Gray Metallic
Melting Point1,890°C
SputterDC
Density6.11 g/cc
Thermal Conductivity30.7 W/m.K
Type of BondWets Mo. E-beam-evaporated films preferred.
Target Dimensions & ThicknessDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Vanadium Sputtering Target Application

Standard vanadium sputtering materials are used for various thin-film coating applications, including CD-ROMs, decoration, flat panel displays, functional coatings, and other optical information storage industries. They are also used in the glass coating industry for car glass and architectural glass, as well as in optical communications. Vanadium is primarily used in alloys, especially with steel. Approximately 85% of all vanadium produced is used in steel, 10% in titanium alloys, and 5% in other applications.

Vanadium Sputtering Target Bonding Service

Specialized bonding services for Vanadium  Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Packaging

Our high-purity vanadium sputter targets are clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation, preserving the quality and integrity of our products.

Get Contact

TFM offers Vanadium  Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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