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Copper Nickel Sputtering Target

ST0089 Copper Nickel Sputtering Target, Cu/Ni

Chemical Formula: Cu/Ni
Catalog Number: ST0089
CAS Number: 7440-50-8 | 7440
Purity: 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Copper Nickel sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Copper Nickel (Cu/Ni) Sputtering Targets are widely used alloy targets for depositing functional and conductive thin films where controlled electrical properties, corrosion resistance, and strong adhesion are required. By combining the high electrical conductivity of copper with the chemical stability and mechanical strength of nickel, Cu/Ni alloys offer a balanced performance profile suited to both research-scale and industrial thin-film applications.

Detailed Description

Our Copper Nickel Sputtering Targets are produced from high-purity copper and nickel using carefully controlled alloying and consolidation processes. This ensures excellent compositional uniformity across the target surface, which is essential for achieving consistent film stoichiometry during sputtering.

Compared with pure copper targets, the introduction of nickel improves film hardness, wear resistance, and thermal stability, while also allowing fine tuning of electrical resistivity. These characteristics make Cu/Ni films particularly useful in multilayer structures, diffusion barriers, and resistive layers. The alloy microstructure is optimized to achieve high density and uniform grain distribution, reducing particle generation, arcing, and non-uniform erosion during high-power sputtering.

Copper Nickel Sputtering Targets are compatible with DC and RF magnetron sputtering systems, depending on alloy composition and system configuration. Targets can be supplied as monolithic pieces or bonded to copper or titanium backing plates to enhance heat dissipation, mechanical stability, and target lifetime in demanding deposition environments.

Applications

Copper Nickel Sputtering Targets are commonly used in:

  • Semiconductor and microelectronic thin films

  • Resistive and conductive layers in integrated circuits

  • Magnetic and sensor-related thin films

  • Optical and functional multilayer coatings

  • Research and development of alloy thin films

They are especially suitable for applications requiring controlled resistivity, good adhesion, and long-term film stability.

Technical Parameters

ParameterTypical Value / RangeImportance
CompositionCu/Ni alloy (custom ratios)Determines electrical and mechanical film properties
Purity99.9% – 99.99%Minimizes contamination in deposited films
ShapeRound / Rectangular / CustomMatches different sputtering cathodes
Density≥ 99% theoreticalEnsures stable sputtering and uniform erosion
BondingIndium, elastomer, or monolithicImproves thermal transfer and reliability
Backing PlateCopper or Titanium (optional)Enhances cooling and mechanical strength

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Copper Nickel Sputtering TargetTunable resistivity, good corrosion resistanceElectronic & functional coatings
Pure Copper TargetVery high conductivityGeneral metallization
Pure Nickel TargetChemical stability, hardnessBarrier and protective layers

FAQ

QuestionAnswer
Can the Cu/Ni ratio be customized?Yes, the alloy composition can be adjusted to meet specific film property requirements.
Is DC sputtering suitable?Yes, Cu/Ni targets are commonly used in DC magnetron sputtering systems.
Are backing plates available?Yes, copper or titanium backing plates can be supplied upon request.
What target sizes are offered?Standard and custom dimensions are available based on your equipment.

Packaging

Our Copper Nickel Sputtering Targets are vacuum-sealed, clearly labeled, and packaged with protective materials to prevent oxidation and mechanical damage during handling, storage, and transportation.

Conclusion

Copper Nickel Sputtering Targets provide a reliable and flexible solution for depositing high-quality alloy thin films with controlled electrical and mechanical properties. With customizable composition, high purity, and stable sputtering performance, they are well suited for both advanced research and industrial production.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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