Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
copper-nickel-sputtering-target-png

ST0089 Copper Nickel Sputtering Target, Cu/Ni

Chemical Formula: Cu/Ni
Catalog Number: ST0089
CAS Number: 7440-50-8 | 7440
Purity: 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Copper Nickel sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Copper Nickel Sputtering Target Description

The Copper Nickel Sputtering Target from TFM is an alloy material composed of copper (Cu) and nickel (Ni). This high-quality sputtering material is ideal for applications requiring the combined properties of these two elements.

CopperCopper, symbolized as “Cu,” is a chemical element with a name derived from the Old English word “coper,” which in turn comes from the Latin term ‘Cyprium aes,’ meaning metal from Cyprus. It has been used since around 9000 BC and was discovered by people from the Middle East. Copper has an atomic number of 29 and is located in Period 4, Group 11 of the d-block in the periodic table. Its relative atomic mass is 63.546(3) Daltons, with the number in brackets indicating the measurement uncertainty.

Related Product: Copper Sputtering Target

Nickel

Nickel, symbolized as “Ni,” is a chemical element whose name is derived from the German word ‘kupfernickel,’ meaning either devil’s copper or St. Nicholas’s copper. It was first mentioned and observed by F. Cronstedt in 1751, who also accomplished its isolation. Nickel has an atomic number of 28 and is located in Period 4, Group 10 of the d-block in the periodic table. Its relative atomic mass is 58.6934(2) Daltons, with the number in brackets indicating the measurement uncertainty.

Related Product: Nickel Sputtering Target

Copper Nickel Sputtering Target Specification

Compound FormulaCuNi
Molecular Weight122.239 g/mol
AppearanceMetallic solid in various forms (plate, bar, sheet, strip, powder, foil)
Melting Point1110~1235 ℃
Density8.5-8.95 g/cm3
Electrical Resistivity3.8 x 10-8 Ω·m

Copper Nickel Sputtering Target Application

The Copper Nickel Sputtering Target is widely used for thin film deposition in various industries. Its applications include decoration, semiconductors, displays, LED and photovoltaic devices, functional coatings, and optical information storage. It is also utilized in the glass coating industry for car and architectural glass, as well as in optical communication and other related fields.

Copper Nickel Sputtering Target Packing

Our Copper Nickel Sputter Targets are meticulously tagged and labeled externally to ensure efficient identification and stringent quality control. We take great care to prevent any damage during storage and transportation, ensuring that our products arrive in perfect condition.

Get Contact

TFM offers Copper Nickel Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

Reviews

There are no reviews yet.

Be the first to review “ST0089 Copper Nickel Sputtering Target, Cu/Ni”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top