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Germanium Nitride Sputtering Target

ST0211 Germanium Nitride Sputtering Target, Ge3N4

Chemical Formula: Ge3N4
Catalog Number: ST0211
CAS Number: 12065-36-0
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Germanium Nitride  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Germanium Nitride Sputtering Target Description

Germanium Nitride sputtering target from TFM is a nitride ceramic sputtering material with the chemical formula Ge3N4. This material is commonly used in various thin-film applications due to its excellent properties and stability. It is particularly valued in the semiconductor industry for its use in devices requiring precise material deposition and high-quality films.

GermaniumGermanium is a chemical element named after Germany, known by its Latin name “Germania.” It was first identified in 1886 by the chemist Clemens Winkler. Germanium is represented by the symbol “Ge” and has an atomic number of 32. It is located in Period 4, Group 14 of the periodic table, within the p-block. The relative atomic mass of germanium is 72.64(1) Dalton, with the number in brackets indicating the measurement uncertainty. Germanium is used in a variety of applications, including semiconductors and infrared optics.

Related Product: Germanium Sputtering Target

NitrogenNitrogen is a chemical element named after the Greek words ‘nitron’ and ‘genes,’ which mean nitre-forming. It was first identified in 1772 by the scientist Daniel Rutherford, who also managed to isolate it. Represented by the symbol “N,” nitrogen has an atomic number of 7 and is located in Period 2, Group 15 of the periodic table, within the p-block. Its relative atomic mass is 14.0067(2) Dalton, with the value in parentheses indicating the measurement’s uncertainty. Nitrogen is a major component of Earth’s atmosphere and is essential in various industrial and biological processes.

Germanium Nitride Sputtering Target Application

The germanium nitride sputtering target is commonly utilized in various applications, including thin film deposition and decoration, as well as in the manufacturing of semiconductors, displays, LEDs, and photovoltaic devices. It is also used for functional coatings in the optical information storage industry and for glass coatings in automotive and architectural glass. Additionally, it plays a significant role in optical communication systems.

Germanium Nitride Sputtering Target Packaging

Our germanium nitride sputtering target is meticulously tagged and labeled externally to ensure easy identification and maintain strict quality control. We take significant precautions in handling and packaging the targets to prevent any potential damage during storage or transportation, ensuring the product arrives in pristine condition.

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TFM offers Germanium Nitride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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