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ST0222 Chromium Carbide Sputtering Target, Cr3C2

Chemical Formula: Cr3C2
Catalog Number: ST0222
CAS Number: 12012-35-0
Purity: 99.5%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Chromium Carbide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Chromium Carbide Sputtering Target Description

Chromium Carbide sputtering target from TFM is a high-quality carbide ceramic sputtering material with the chemical formula Cr3C2. This material is known for its hardness, wear resistance, and corrosion resistance, making it suitable for various industrial applications, including thin film deposition, coatings for cutting tools, and surface protection in extreme environments.

ChromiumChromium is a chemical element that gets its name from the Greek word ‘chroma,’ meaning color, due to the various colorful compounds it forms. Its usage dates back to before 1 AD, and it was notably discovered by the Chinese Terracotta Army. The chemical symbol for chromium is “Cr.” It is positioned in Period 4 and Group 6 of the periodic table, within the d-block, and has an atomic number of 24. The relative atomic mass of chromium is 51.9961(6) Dalton, with the value in parentheses indicating the uncertainty.

Related Product: Chromium Sputtering Target

CarbonCarbon, a fundamental chemical element, derives its name from the Latin word ‘carbo,’ meaning charcoal. It has been known and used since 3750 BC, notably by Egyptians and Sumerians. Represented by the symbol “C,” carbon is situated in Period 2 and Group 14 of the periodic table, within the p-block. It has an atomic number of 6, and its relative atomic mass is 12.0107(8) Dalton, with the number in parentheses indicating the uncertainty in this value. Carbon is renowned for its versatility, forming a vast array of compounds, including those essential for life.

Chromium Carbide Sputtering Target Specification

Compound FormulaC2Cr3
Molecular Weight180.01
AppearanceGray
Melting Point1,895℃
Boiling PointN/A
Density6.68 g/cm3

Chromium Carbide Sputtering Target Application

The chromium carbide sputtering target is commonly utilized in various high-tech applications, including thin film deposition and functional coatings. Its uses extend to industries such as semiconductors, displays, LEDs, and photovoltaic devices. Additionally, chromium carbide is favored in decorative coatings, glass coatings (including automotive and architectural glass), and optical communication components. Its properties make it valuable in the production of coatings for optical information storage devices and other specialized industrial applications.

Chromium Carbide Sputtering Target Packaging

Our chromium carbide sputtering target is meticulously tagged and labeled on the exterior to facilitate easy identification and maintain quality control standards. We take extensive precautions to prevent any damage during storage and transportation, ensuring that the product reaches you in optimal condition.

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TFM offers Chromium Carbide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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