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ST0247 Manganese Fluoride Sputtering Target, MnF2

Chemical Formula: MnF2
Catalog Number: ST0247
CAS Number: 7782-64-1
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Manganese Fluoride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Manganese Fluoride Sputtering Target

Introduction

Manganese Fluoride (MnF₂) Sputtering Target is an advanced material designed for thin film deposition in specialized optical, electronic, and research applications. With its unique chemical and physical properties, MnF₂ provides excellent performance in coating processes that require high transparency, low refractive index, and strong adhesion. It is particularly valued in optics and photonics due to its infrared transmission and stability under controlled sputtering environments.

Detailed Description

The Manganese Fluoride Sputtering Target is produced from high-purity MnF₂ powder, consolidated into dense, uniform targets suitable for both RF and DC sputtering systems. Typical purities range from 99.9% to 99.99%, ensuring low impurity levels that could otherwise interfere with film quality.

  • Purity: High-purity MnF₂ reduces scattering centers, improving thin film optical performance.

  • Density & Microstructure: Fine-grained, homogeneous targets enable consistent sputtering rates and stable deposition.

  • Size & Bonding: Available in diameters from 25 mm to 300 mm, with thicknesses of 3–6 mm, and customizable with indium or elastomer bonding to copper or titanium back plates for enhanced thermal management.

  • Optical Characteristics: Films derived from MnF₂ are transparent in a wide wavelength range, including the ultraviolet and infrared regions, making them suitable for precision optical devices.

Applications

Manganese Fluoride Sputtering Targets are used in a variety of industries and research fields:

  • Optics & Photonics – Coatings for infrared windows, lenses, and beam splitters.

  • Semiconductor Devices – Thin films for insulating or optical layers in microelectronics.

  • Energy & Displays – Functional coatings in photovoltaic devices and advanced display technologies.

  • Research & Development – Experimental thin films for material science and nanotechnology studies.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Higher purity improves optical and electronic film quality
Diameter25 – 300 mm (custom)Matches standard sputtering system holders
Thickness3 – 6 mmAffects deposition stability and sputtering efficiency
BondingCopper / Titanium backingEnsures heat transfer and target durability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Manganese Fluoride (MnF₂)Wide IR transparency, stable filmsOptical & photonics coatings
Magnesium Fluoride (MgF₂)Very low refractive indexAnti-reflective coatings
Calcium Fluoride (CaF₂)High laser damage thresholdUV and laser optics

FAQ

QuestionAnswer
Can the target size be customized?Yes, diameter, thickness, and bonding can be tailored for your system.
What is the delivery time?Standard lead time is 2–3 weeks depending on order size and customization.
How is it packaged?Vacuum-sealed, cushioned with foam, and shipped in export-safe cartons or wooden crates.
Which industries use MnF₂ most?Optics, semiconductors, energy research, and advanced R&D labs.
Can it be bonded to a backing plate?Yes, indium or elastomer bonding with copper/titanium plates is available.

Packaging

Our Manganese Fluoride Sputtering Targets are carefully labeled and securely packaged to maintain quality during storage and transport. Vacuum sealing prevents contamination, while external protective cartons or wooden crates ensure the targets arrive intact and ready for use.

Conclusion

Manganese Fluoride Sputtering Targets offer a reliable and high-performance option for thin film deposition in optical, electronic, and research applications. With customizable dimensions, excellent purity, and stable sputtering characteristics, they are an essential choice for demanding coating projects.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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