Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors

ST0257 Yttrium Fluoride Sputtering Target, YF3

Chemical Formula: YF3
Catalog Number: ST0257
CAS Number: 13709-49-4
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Yttrium Fluoride  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.
YF3 Grain Inspection.pdf

Introduction

The Yttrium Fluoride Sputtering Target (YF₃) is a high-performance fluoride ceramic target designed for thin-film applications that demand excellent infrared transparency, low optical absorption, and high chemical stability. YF₃ is widely used in advanced optical and photonic coatings, particularly in infrared (IR) systems where oxide materials may exhibit excessive absorption. Its stable fluoride chemistry makes it a reliable material for both research and precision optical manufacturing.


Detailed Description

Yttrium Fluoride sputtering targets are fabricated from high-purity YF₃ powders using controlled powder processing, compaction, and sintering techniques. Because fluoride materials are sensitive to moisture, strict environmental control is applied throughout manufacturing, machining, and final packaging to preserve material integrity and stoichiometry.

The finished YF₃ target exhibits uniform composition, high density, and stable sputtering behavior, enabling reproducible thin-film deposition. Compared with many oxide targets, YF₃ produces films with lower phonon energy and reduced IR absorption, which is essential for mid-IR and far-IR optical components. These targets are typically used in RF magnetron sputtering systems, where deposition parameters such as power density, substrate temperature, and chamber pressure can be optimized for smooth, high-quality fluoride films.


Applications

Yttrium Fluoride sputtering targets are commonly used in:

  • Infrared (IR) optical coatings

  • Anti-reflection (AR) coatings for IR lenses and windows

  • Fluoride-based optical multilayer stacks

  • Laser optics and photonic components

  • Scientific and analytical optical instrumentation

  • Advanced thin-film materials research


Technical Parameters

ParameterTypical Value / RangeImportance
Chemical FormulaYF₃Defines fluoride optical properties
Purity99.9% – 99.99%Minimizes optical absorption
Target Diameter25 – 300 mm (custom)Fits standard sputtering systems
Thickness3 – 6 mm (custom available)Influences sputtering stability
Density≥ 95% of theoreticalEnsures uniform erosion
Moisture SensitivityHygroscopicRequires controlled handling
Deposition MethodRF Magnetron SputteringSuitable for fluoride ceramics

Comparison with Related Fluoride Targets

MaterialKey AdvantageTypical Application
Yttrium Fluoride (YF₃)Low IR absorption, good stabilityIR optical coatings
Magnesium Fluoride (MgF₂)Broad transparency rangeAR coatings
Zirconium Fluoride (ZrF₄)Low phonon energyIR optics
Lanthanum Fluoride (LaF₃)Higher refractive indexOptical multilayers

FAQ

QuestionAnswer
Is YF₃ suitable for infrared optics?Yes, it is widely used for IR coatings due to low absorption.
Does YF₃ absorb moisture?Yes, careful moisture control and vacuum packaging are essential.
Is RF sputtering required?RF sputtering is recommended for stable deposition of YF₃ films.
Can small R&D targets be supplied?Yes, laboratory-scale sizes are available.
How is the target packaged?Vacuum-sealed with moisture-resistant protective materials.

Packaging

Our Yttrium Fluoride Sputtering Targets (YF₃) are meticulously vacuum-sealed and clearly labeled to ensure accurate identification and strict quality control. Moisture-resistant wrapping and shock-absorbing packaging are used to protect the target during storage and international transportation.


Conclusion

The Yttrium Fluoride Sputtering Target (YF₃) provides a dependable solution for depositing high-quality fluoride thin films with excellent infrared transparency and optical stability. With controlled purity, customizable dimensions, and carefully managed handling, YF₃ targets are well suited for advanced optical coating systems and photonic research applications.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Reviews

There are no reviews yet.

Be the first to review “ST0257 Yttrium Fluoride Sputtering Target, YF3”

Your email address will not be published. Required fields are marked *

Related Products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top