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ST0282 Magnesium Sulfide Sputtering Target, MgS

Chemical Formula: MgS
Catalog Number: ST0282
CAS Number: 12032-36-9
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Magnesium Sulfide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Magnesium Sulfide Sputtering Targets are advanced compound deposition materials used for producing sulfur-containing thin films with controlled optical and electronic characteristics. As a metal sulfide material, magnesium sulfide (MgS) is of particular interest in optical coating research, infrared-related materials, and compound semiconductor studies where film composition precision and purity are critical.

Detailed Description

Magnesium Sulfide sputtering targets are produced through tightly controlled synthesis and consolidation processes to ensure homogeneous chemical composition, high density, and mechanical stability. Due to the inherent moisture sensitivity of sulfide compounds, manufacturing and handling are carried out under controlled environments to minimize oxidation and contamination.

Targets are available in unbonded form for low-to-moderate power applications, or bonded to copper or titanium backing plates for improved thermal conductivity and structural integrity during higher-power sputtering. Uniform microstructure and purity are essential for achieving stable sputtering rates, reduced arcing, and consistent film stoichiometry.

Magnesium Sulfide targets are commonly used with RF magnetron sputtering systems, which provide better control when depositing insulating or compound materials. Custom sizes, thicknesses, and bonding configurations can be supplied to match specific sputtering cathodes and process requirements.

Applications

  • Optical and infrared thin film research

  • Sulfide-based functional coatings

  • Semiconductor and electronic materials R&D

  • Experimental compound thin films

  • Academic and industrial PVD studies

Technical Parameters

ParameterTypical Value / RangeImportance
MaterialMagnesium Sulfide (MgS)Sulfide compound for functional films
Purity99.9% – 99.99%Directly affects film quality
FormDisc / PlateCompatible with sputtering systems
Diameter25 – 300 mm (custom)Fits standard magnetron cathodes
Thickness3 – 6 mm (typical)Influences target lifetime
Backing PlateCopper / Titanium (optional)Enhances heat dissipation

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Magnesium SulfideSulfur-containing functional filmsOptical & IR research
Magnesium OxideChemically stable oxideDielectric coatings
Zinc SulfideHigh refractive indexOptical multilayers

FAQ

QuestionAnswer
Can Magnesium Sulfide targets be customized?Yes, purity, size, thickness, and bonding can be tailored.
Is RF sputtering required?RF sputtering is typically recommended for MgS targets.
How is moisture sensitivity managed?Targets are processed and vacuum- or inert-gas packed.
Are bonded targets available?Yes, copper- or titanium-backed targets can be supplied.
Is a Certificate of Analysis included?A CoA is available upon request.

Packaging

Our Magnesium Sulfide Sputtering Targets are carefully labeled and vacuum-sealed or inert-gas packed to protect against moisture and contamination. Shock-absorbing packaging materials and export-grade cartons ensure the targets arrive in optimal condition.

Conclusion

Magnesium Sulfide Sputtering Targets provide stable sputtering behavior, controlled composition, and high purity for sulfur-based thin film deposition. With flexible customization options and strict handling controls, they are well suited for optical, electronic, and research-focused PVD applications.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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MgS Target 3N Ø101.6×3.18 mm In Bonded 3.18 mm Cu BP

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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