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ST0284 Molybdenum Disulfide Sputtering Target, MoS2

Chemical Formula: MoS2
Catalog Number: ST0284
CAS Number: 1317-33-5
Purity: >99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Molybdenum Disulfide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Molybdenum Sulfide Sputtering Target Description

Molybdenum**Molybdenum** is a chemical element that originates from the Greek word ‘molybdos,’ meaning lead. It was first mentioned in 1778 and observed by W. Scheele, with the isolation later accomplished and announced by J. Hjelm. The canonical chemical symbol for molybdenum is “Mo.” It has an atomic number of 42, placing it in Period 5 and Group 6 of the periodic table, within the d-block. The relative atomic mass of molybdenum is 95.94(2) Dalton, with the number in brackets indicating the measurement uncertainty.

Related Product: Molybdenum Sputtering Target

SulfurSulfur, also called sulphur, is a chemical element originated from Either from the Sanskrit ‘sulvere’, or the Latin ‘sulfurium’, both names for sulfur. It was early used before 2000 BC and discovered by Chinese and Indians. “S” is the canonical chemical symbol of sulfur. Its atomic number in the periodic table of elements is 16 with location at Period 3 and Group 16, belonging to the p-block. The relative atomic mass of sulfur is 32.065(5) Dalton, the number in the brackets indicating the uncertainty.

Molybdenum Disulfide Sputtering Target Specification

Material TypeMolybdenum Sulfide
SymbolMoS2
Color/AppearanceBlack, Crystalline Solid
Melting Point (°C)1,185
Theoretical Density (g/cm3)5.06
SputterRF
Type of BondIndium, Elastomer

Molybdenum Disulfide Sputtering Target Bonding

Specialized bonding services for MolybdenumDisulfide Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Molybdenum Disulfide Sputtering Target Packaging

Our molybdenum disulfide sputtering target is meticulously tagged and labeled externally to ensure efficient identification and strict quality control. We take great care to prevent any damage during storage or transportation, maintaining the product’s integrity and quality throughout the handling process.

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TFM offers Molybdenum Disulfide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.
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MoS₂ Target 4N ø50.0*3.0mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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