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ST0303 Cadmium Selenide Sputtering Target, CdSe

Chemical Formula: CdSe
Catalog Number: ST0303
CAS Number: 1306-24-7
Purity: 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Cadmium Selenide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Cadmium Selenide (CdSe) sputtering targets are widely used for depositing II–VI semiconductor thin films with well-defined optical and electronic properties. Known for its direct bandgap and strong light absorption in the visible spectrum, CdSe is a key material in optoelectronic devices, photovoltaics, and quantum dot technologies. High-quality CdSe sputtering targets enable precise control over film composition and are essential for achieving reproducible device performance.

Detailed Description

CdSe sputtering targets are manufactured with strict control over stoichiometry (Cd:Se ≈ 1:1) and microstructure to ensure stable sputtering behavior and uniform film deposition. Production methods such as vacuum hot pressing or sintering are commonly used to achieve high density and minimize porosity, which is critical for reducing particle generation and ensuring consistent erosion during sputtering.

Cadmium Selenide exhibits a direct bandgap of approximately 1.74 eV at room temperature, making it highly suitable for light-emitting and light-absorbing applications. The material supports efficient electron-hole pair generation, which is beneficial for photodetectors, solar cells, and LEDs.

Due to the volatility of selenium and the toxicity of cadmium, careful handling and processing are required during both target fabrication and sputtering. High-density targets help maintain compositional uniformity and reduce preferential sputtering effects. For improved thermal management and mechanical stability, CdSe targets are often bonded to copper backing plates.

Key features include:

  • Controlled stoichiometry for consistent semiconductor properties

  • High density and low porosity for stable sputtering performance

  • Strong optical absorption and direct bandgap behavior

  • Suitable for RF magnetron sputtering of compound semiconductors

  • Customizable dimensions, purity levels, and bonding configurations

Applications

Cadmium Selenide sputtering targets are widely used in:

  • Thin film solar cells and photovoltaic research

  • Photodetectors and optical sensors

  • Light-emitting devices (LEDs) and display technologies

  • Quantum dot materials and nanostructures

  • Thin film transistors and semiconductor devices

  • Research in optoelectronics and nanotechnology

Technical Parameters

ParameterTypical Value / RangeImportance
CompositionCdSe (Cd:Se ≈ 1:1)Determines optical and electronic properties
Purity99.9% – 99.99%Reduces defect levels in films
Density≥ 95% – 99% theoreticalEnsures stable sputtering behavior
Diameter25 – 200 mm (custom)Compatible with sputtering systems
Thickness3 – 6 mmAffects target lifetime
BondingCopper backing (In / elastomer)Improves heat dissipation
Sputtering MethodRF magnetronPreferred for compound materials

Comparison with Related Materials

MaterialKey AdvantageTypical Application
CdSeDirect bandgap, strong visible absorptionOptoelectronics, quantum dots
CdTeHigh photovoltaic efficiencySolar cells
ZnSeWide bandgap, optical transparencyOptical coatings
PbSeInfrared sensitivityIR detectors

FAQ

QuestionAnswer
Can the CdSe target be customized?Yes, dimensions, purity, and bonding options can be tailored to specific needs.
What sputtering method is recommended?RF magnetron sputtering is typically used for CdSe deposition.
Are there safety considerations?Yes, cadmium compounds are toxic; proper handling and ventilation are required.
Is stoichiometry critical?Yes, maintaining the Cd:Se ratio is essential for consistent film performance.
What industries use CdSe most?Photovoltaics, optoelectronics, and nanotechnology research.

Packaging

Our Cadmium Selenide Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.

Conclusion

Cadmium Selenide sputtering targets provide a reliable solution for producing high-quality semiconductor thin films with excellent optical and electronic performance. With precise composition control and customizable configurations, they are ideal for advanced optoelectronic devices, photovoltaic systems, and cutting-edge research.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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