Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
Lanthanum Strontium Chromate Sputtering Target

ST0448 Lanthanum Strontium Chromate Sputtering Target, La(1-x)SrxCrO3

Chemical Formula: La(1-x)SrxCrO3
Catalog Number: ST0448
Purity: 99.9%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lanthanum Scandium Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Lanthanum Strontium Chromate (La₁₋ₓSrₓCrO₃, commonly referred to as LSCr) is a perovskite oxide material widely used in high-temperature electrochemical systems and functional oxide electronics. Known for its excellent electrical conductivity, chemical stability, and resistance to harsh environments, LSCr is a key material for solid oxide fuel cells (SOFCs), interconnect coatings, and advanced thin film devices. High-quality sputtering targets are essential to achieve uniform, defect-free films with controlled stoichiometry.

Detailed Description

Lanthanum Strontium Chromate adopts a perovskite crystal structure, where partial substitution of lanthanum (La) by strontium (Sr) enables precise tuning of electrical conductivity and thermal expansion behavior. The compositional parameter “x” (typically ranging from 0.1 to 0.5) directly influences charge carrier concentration and transport properties, making LSCr highly adaptable for different functional applications.

LSCr sputtering targets are produced through advanced ceramic processing techniques, including high-purity powder synthesis, calcination, and high-temperature sintering. Achieving phase-pure perovskite structure and high density is critical, as porosity or compositional inhomogeneity can negatively impact sputtering stability and thin film quality.

Compared to manganate-based perovskites, LSCr offers superior chemical and thermal stability under both oxidizing and reducing atmospheres, which is particularly important for high-temperature applications such as SOFC interconnects. Dense targets (≥95% theoretical density) ensure consistent sputtering rates, reduced particle generation, and improved film uniformity.

For enhanced thermal management during deposition, targets can be supplied with copper backing plates using indium or elastomer bonding. Custom compositions and geometries are available to match specific process requirements.

Applications

Lanthanum Strontium Chromate Sputtering Targets are widely used in:

  • Solid Oxide Fuel Cells (SOFCs): Interconnect coatings and conductive layers
  • High-Temperature Electronics: Stable conductive oxide films
  • Protective Coatings: Oxidation-resistant layers in harsh environments
  • Oxide Electronics: Functional thin films in perovskite-based devices
  • Research & Development: Studies on mixed ionic-electronic conductors

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical FormulaLa₁₋ₓSrₓCrO₃Defines perovskite structure
Composition (x)0.1 – 0.5 (customizable)Controls conductivity and stability
Purity≥ 99.9% (3N)Ensures phase purity and performance
Density≥ 95% theoretical densityImproves sputtering efficiency
Diameter25 – 200 mm (custom)Fits sputtering systems
Thickness3 – 6 mmAffects deposition rate and lifetime
BondingUnbonded / Cu-backed (Indium/Elastomer)Enhances heat dissipation

Comparison with Related Materials

MaterialKey AdvantageTypical Application
La₁₋ₓSrₓCrO₃ (LSCr)High thermal stability, oxidation resistanceSOFC interconnects
La₁₋ₓSrₓMnO₃ (LSMO)Strong magnetic and conductive propertiesSpintronics, electrodes
LaCrO₃Stable but lower conductivityBasic oxide coatings
SrTiO₃Excellent dielectric propertiesSubstrates, capacitors

FAQ

QuestionAnswer
Can the Sr doping level (x) be customized?Yes, the composition can be tailored to optimize electrical and thermal properties for specific applications.
Is LSCr suitable for high-temperature deposition?Yes, it is highly stable under elevated temperatures and harsh environments.
What sputtering method is recommended?RF sputtering is typically used due to the ceramic nature of the material.
Can bonded targets be supplied?Yes, copper-backed targets with indium or elastomer bonding are available.
Which industries use LSCr targets?Energy (SOFC), advanced coatings, electronics, and research institutions.

Packaging

Our Lanthanum Strontium Chromate Sputtering Target, La₁₋ₓSrₓCrO₃, is meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the target arrives in perfect condition.

Conclusion

Lanthanum Strontium Chromate Sputtering Targets provide a robust solution for depositing high-performance oxide thin films in demanding environments. With excellent thermal stability, tunable conductivity, and customizable specifications, LSCr is an ideal material for energy systems and advanced functional coatings.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Reviews

There are no reviews yet.

Be the first to review “ST0448 Lanthanum Strontium Chromate Sputtering Target, La(1-x)SrxCrO3”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top