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Samarium Cerium Copper Oxide Sputtering Target

ST0466 Samarium Cerium Copper Oxide Sputtering Target

Chemical Formula: Sm(1-x)CexCuO4
Catalog Number: ST0466
Purity: 99.9%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Samarium Cerium Copper Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Samarium Cerium Copper Oxide Sputtering Targets are complex oxide ceramic materials designed for advanced thin-film deposition where precise control of electrical behavior, oxygen stoichiometry, and rare-earth functionality is required. By integrating samarium (Sm), cerium (Ce), and copper (Cu) within an oxide matrix, this material system supports functional oxide films used in electronic ceramics, energy devices, and exploratory oxide-electronics research.

Detailed Description

Samarium Cerium Copper Oxide sputtering targets are produced from high-purity precursor oxides with carefully controlled elemental ratios. Through advanced ceramic processing—including homogeneous powder mixing, calcination, pressing, and high-temperature sintering—the targets achieve high density, uniform microstructure, and stable sputtering performance.

The inclusion of samarium and cerium, both rare-earth elements, enables tunable electronic structure, oxygen vacancy behavior, and redox activity, while copper oxide contributes conductive pathways and functional electronic properties. This combination allows researchers and engineers to tailor thin-film conductivity, defect chemistry, and interfacial behavior without relying solely on reactive gas modulation.

Due to their ceramic and semiconducting nature, Samarium Cerium Copper Oxide targets are typically operated under RF sputtering conditions to ensure stable plasma coupling and uniform erosion. Targets can be supplied as monolithic ceramics or bonded to backing plates to enhance thermal stability during higher-power operation.

Applications

Samarium Cerium Copper Oxide sputtering targets are commonly used in:

  • Functional oxide electronics: Complex oxide thin films with tunable conductivity

  • Energy materials: Electrodes and functional layers in solid-state energy devices

  • Electronic ceramics research: Rare-earth–doped oxide systems

  • Sensors: Oxide films sensitive to oxygen content and redox behavior

  • Spintronic & correlated materials research: Exploration of multi-component oxide systems

  • Academic & industrial R&D: Novel oxide heterostructures and interfaces

Technical Parameters

ParameterTypical Value / RangeImportance
CompositionSm–Ce–Cu–O (custom ratios)Controls electrical & redox behavior
Purity99.9% – 99.99%Reduces contamination in thin films
Diameter25 – 200 mm (custom)Fits standard sputtering cathodes
Thickness3 – 6 mm (typical)Influences target lifetime
Density≥ 95% of theoreticalEnsures stable sputtering
Sputtering ModeRF sputteringSuitable for ceramic oxides
BondingIndium / Elastomer / DirectImproves thermal & mechanical stability

Comparison with Related Oxide Targets

MaterialKey AdvantageTypical Application
Sm–Ce–Cu OxideTunable rare-earth & copper functionalityAdvanced oxide research
CeO₂Oxygen storage capabilityCatalysts, sensors
Sm₂O₃Rare-earth electronic effectsFunctional ceramics
CuO / Cu₂OP-type conductivityElectronics & sensors

FAQ

QuestionAnswer
Can the elemental ratios be customized?Yes, Sm/Ce/Cu ratios can be tailored to your specifications.
Which sputtering method is recommended?RF sputtering is generally preferred for this ceramic oxide.
Is the target suitable for research applications?Yes, it is commonly used in advanced materials and oxide-electronics research.
How is the target packaged?Vacuum-sealed with reinforced protective packaging.

Packaging

Our Samarium Cerium Copper Oxide Sputtering Targets are meticulously tagged and labeled to ensure accurate identification and strict quality control. Each target is vacuum-sealed and protected with reinforced cushioning to prevent contamination, moisture exposure, or mechanical damage during storage and transportation.

Conclusion

Samarium Cerium Copper Oxide Sputtering Targets provide a flexible and reliable platform for depositing complex oxide thin films with rare-earth and copper-based functionalities. With precise compositional control, stable sputtering behavior, and customizable formats, these targets are well suited for advanced research and emerging electronic applications.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Related products: Samarium Sputtering Target, Cerium Sputtering Target, Copper Sputtering Target, Oxide Ceramic Sputtering Target

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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