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ST0489 Bismuth Antimony Sputtering Target, Bi/Sb

Chemical Formula: Bi/Sb
Catalog Number: ST0489
Purity: 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Bismuth Antimony sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

COA_BiSb_TRGPdf

Introduction

Bismuth Antimony sputtering targets are alloy materials widely used in thin-film deposition for thermoelectric, electronic, and functional material research. By combining bismuth and antimony in controlled ratios, Bi–Sb alloy targets enable precise tuning of electrical conductivity, carrier concentration, and band structure. They are particularly important in low-temperature thermoelectric devices and advanced semiconductor research where material composition plays a decisive role in performance.

Detailed Description

Bismuth Antimony is a well-known solid-solution alloy system in which antimony is added to bismuth to modify electronic structure and transport behavior. Small changes in composition can significantly influence carrier mobility and thermoelectric efficiency, making compositional accuracy essential for thin-film applications.

Our Bismuth Antimony sputtering targets are produced from high-purity bismuth and antimony using vacuum melting and alloy homogenization processes. The targets exhibit uniform composition, high density, and good mechanical integrity, ensuring stable sputtering rates and reproducible film properties. Careful control of microstructure helps reduce particle generation and compositional drift during deposition.

Bi–Sb targets are compatible with DC magnetron sputtering systems due to their metallic conductivity. Standard planar disc targets are available, with optional bonding to copper backing plates to improve thermal management and reduce stress during higher-power sputtering. Custom alloy ratios, dimensions, and bonding solutions can be provided to meet specific research or pilot-scale production needs.

Applications

Bismuth Antimony sputtering targets are commonly used in:

  • Thermoelectric thin films and devices

  • Topological insulator and quantum material research

  • Low-temperature electronic and sensing applications

  • Functional alloy thin films for semiconductor research

  • Academic and industrial R&D in advanced materials

Technical Parameters

ParameterTypical Value / RangeImportance
MaterialBismuth Antimony Alloy (Bi–Sb)Defines electronic & thermoelectric behavior
Purity99.9% – 99.99%Minimizes impurity-related defects
CompositionCustom Bi/Sb ratiosTunes band structure & conductivity
Diameter1″ – 4″ (custom available)Fits standard sputtering cathodes
Thickness3 – 6 mmAffects sputtering lifetime
DensityHigh, alloy-controlledEnsures stable sputtering rate
Backing PlateOptional CuImproves heat dissipation

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Bismuth AntimonyTunable electronic & thermoelectric propertiesThermoelectrics, quantum materials
Pure BismuthLow carrier densitySensors, research films
AntimonySemimetal behaviorSemiconductor applications
Bismuth TellurideHigh thermoelectric efficiencyTE modules

FAQ

QuestionAnswer
Can the Bi/Sb ratio be customized?Yes, alloy composition can be tailored to your specific requirements.
Is this target suitable for DC sputtering?Yes, Bi–Sb targets are conductive and compatible with DC sputtering.
Are bonded targets available?Yes, copper-bonded targets can be supplied upon request.
What applications most commonly use Bi–Sb films?Thermoelectric devices and advanced electronic material research.

Packaging

Our Bismuth Antimony Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and strict quality control. Each target is vacuum-sealed and protected with shock-absorbing materials to prevent contamination or mechanical damage during storage and transportation.

Conclusion

Bismuth Antimony sputtering targets provide precise compositional control, stable sputtering performance, and reliable film quality for advanced thermoelectric and electronic thin-film applications. With flexible alloy customization and high manufacturing standards, Bi–Sb targets are an excellent choice for research-driven and specialized PVD processes.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Order Now

BiSb target 85/15 wt% ø50.8×2mm Cu B/Plate, BiSb target 85/15 wt% ø50.8×3mm Cu B/Plate, BiSb Target 85/15 at% Ø2"×3 mm In Bonded 2 mm Cu BP

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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