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ST0508 Silicon Chromium Sputtering Target, Si/Cr

Chemical Formula: Si/Cr
Catalog Number: ST0508
Purity: 99%~99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Silicon Chromium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

The Silicon Chromium (Si/Cr) Sputtering Target is a specialized alloy target used in thin film deposition processes for semiconductor devices, protective coatings, and advanced electronic materials. By combining silicon with chromium, this alloy provides a unique balance of electrical performance, corrosion resistance, and thermal stability, making it suitable for a variety of high-performance thin film applications.

In Physical Vapor Deposition (PVD) systems such as DC or RF magnetron sputtering, Si/Cr sputtering targets are used to produce thin films with excellent adhesion, chemical stability, and controlled electrical properties. These films are often applied in semiconductor processing, diffusion barrier layers, and protective coatings where reliable performance and structural durability are essential.

Detailed Description

Silicon Chromium Sputtering Targets are manufactured using high-purity silicon and chromium materials through advanced metallurgical processes such as vacuum melting, powder metallurgy, or hot pressing. These processes ensure homogeneous composition, high density, and stable microstructure, which are essential for consistent sputtering performance.

The combination of silicon and chromium provides complementary material characteristics:

  • Chromium contributes excellent corrosion resistance, strong adhesion to substrates, and improved hardness.

  • Silicon enhances thermal stability and can modify the electrical properties of the thin film.

These characteristics make Si/Cr alloy films suitable for applications where mechanical durability, chemical stability, and controlled electrical behavior are required.

Si/Cr sputtering targets may be used in both DC magnetron sputtering (for conductive compositions) and RF sputtering depending on the specific alloy ratio and deposition conditions. During deposition, the sputtered atoms form uniform thin films on substrates such as silicon wafers, glass, ceramics, or metals.

Targets are available in circular discs, rectangular plates, and custom shapes to match various sputtering cathodes used in laboratory and industrial systems. For larger targets or high-power sputtering equipment, Si/Cr targets can be bonded to copper backing plates using indium bonding or elastomer bonding to enhance heat dissipation and mechanical stability.

High-density targets help maintain stable sputtering rates, reduce particle generation, and ensure consistent thin film quality.

Applications

Thin films deposited from Silicon Chromium Sputtering Targets are used in several advanced technologies:

  • Semiconductor manufacturing – diffusion barriers and functional thin films in microelectronic devices.

  • Protective coatings – corrosion-resistant and wear-resistant thin film layers.

  • Microelectronics – conductive or semi-conductive layers used in integrated circuits.

  • Thin film resistors and electronic components – materials with controlled electrical properties.

  • Optical and functional coatings – stable coatings used in precision instruments.

  • Materials science research – experimental alloy thin films for advanced materials development.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99% metalsHigher purity improves film quality and device reliability
CompositionCustom Si/Cr ratiosAllows tuning of electrical and mechanical properties
Density≥99% theoreticalEnsures stable sputtering and uniform deposition
Diameter25 – 300 mm (custom)Compatible with various sputtering cathodes
Thickness3 – 6 mmInfluences sputtering rate and target lifetime
BondingCopper backing plate (optional)Improves heat transfer and structural stability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Silicon Chromium (Si/Cr)Balanced electrical stability and corrosion resistanceSemiconductor thin films and protective coatings
Chromium (Cr)Excellent adhesion and corrosion resistanceProtective coatings and adhesion layers
Silicon (Si)Semiconductor propertiesElectronic devices and microelectronics

FAQ

QuestionAnswer
Can Si/Cr sputtering targets be customized?Yes, the silicon-to-chromium ratio, dimensions, and bonding options can be customized according to deposition requirements.
Which sputtering method is recommended for Si/Cr targets?DC magnetron sputtering is commonly used when the alloy is conductive, while RF sputtering may be used for certain compositions.
Are bonded targets available?Yes, Si/Cr targets can be indium-bonded or elastomer-bonded to copper backing plates for improved thermal management.
What substrates are compatible with Si/Cr thin films?Silicon wafers, glass, ceramics, and metal substrates are commonly used depending on the application.
Which industries commonly use Si/Cr sputtering targets?Semiconductor manufacturing, microelectronics production, protective coating industries, and advanced materials research laboratories.

Packaging

Our Silicon Chromium Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain strict quality control standards. Each target is vacuum-sealed and packaged with protective cushioning materials to prevent contamination or mechanical damage during storage and transportation. Export-grade cartons or wooden crates are used for safe international delivery.

Conclusion

The Silicon Chromium (Si/Cr) Sputtering Target is a versatile alloy target designed for the deposition of durable and stable thin films used in semiconductor devices, protective coatings, and advanced electronic components. Its combination of corrosion resistance, thermal stability, and tunable electrical properties makes it a valuable material in modern thin film technologies.

With customizable compositions, high purity levels, and precision manufacturing, Si/Cr sputtering targets provide reliable performance for both research laboratories and industrial deposition systems.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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