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Chromium Cobalt Nickel High-Entropy Alloy (HEA) Sputtering Target, Co/Cr/Ni

Catalog No.TFM-SPT-0119
Chemical FormulaCo/Cr/Ni
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Chromium Cobalt Nickel High-Entropy Alloy (HEA) sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Product Overview

Chromium Cobalt Nickel High-Entropy Alloy (HEA) Sputtering Target (Co/Cr/Ni) is an alloy sputtering target used to deposit composition-controlled alloy films. Relative to a pure elemental target, the alloying constituents are introduced to tune electrical, magnetic, optical, mechanical, or adhesion-related film properties. For this reason, alloy ratio, homogeneity, purity basis, and the intended film composition should be defined clearly in the procurement specification.

Material and Deposition Characteristics

Many alloy targets are electrically conductive and can be compatible with DC or pulsed-DC magnetron sputtering, subject to the actual alloy composition and equipment capability. The target composition is not always reproduced exactly in the deposited film because preferential sputtering, re-sputtering, substrate heating, and process gas conditions can shift the final ratio. For composition-sensitive work, deposited-film analysis should be part of process qualification.

Technical Data

ParameterTypical Value / RangeImportance
MaterialChromium Cobalt Nickel High-Entropy AlloyMulti-principal alloy system for advanced thin-film deposition
CompositionCo/Cr/Ni, custom atomic ratio availableDetermines film structure and functional properties
Purity99.9% – 99.99%Lower impurity levels support cleaner film growth
Diameter25 – 300 mm (custom)Fits a wide range of sputtering cathodes
Thickness3 – 8 mmInfluences target lifetime and sputtering stability
DensityHigh-density consolidated alloyImproves erosion uniformity and process consistency
BondingCopper backing plate or custom bonding availableEnhances thermal management during sputtering
Manufacturing RouteCast, hot-pressed, or powder-metallurgy basedAffects homogeneity and microstructure
Surface ConditionPrecision machined, ready to installSupports reliable plasma ignition and even sputtering
MaterialKey AdvantageTypical Application
Chromium Cobalt Nickel HEA Sputtering TargetBalanced multi-element alloy designHEA thin films, protective and functional coatings
Chromium Sputtering TargetStrong corrosion and wear contributionHard coatings, adhesion layers
Cobalt Nickel Sputtering TargetUseful magnetic and structural alloy combinationMagnetic films, electronic coatings
Nickel Chromium Sputtering TargetEstablished resistive and protective film materialThin-film resistors, oxidation-resistant coatings
QuestionAnswer
Can the Co/Cr/Ni HEA sputtering target be customized?Yes. Composition ratio, purity, dimensions, and bonding structure can be customized based on your sputtering system and film design goals.
Why use a pre-alloyed HEA target instead of separate elemental targets?A pre-alloyed target can simplify deposition, improve repeatability, and help maintain more consistent film composition.
Is this target suitable for research applications?Yes. It is widely suited to universities, laboratories, and R&D teams studying high-entropy alloy thin films and advanced coatings.
What backing plate options are available?Copper backing plates and other custom bonding solutions are commonly available to improve heat transfer and target stability.
How is the target packaged for shipment?It is typically vacuum-sealed, carefully cushioned, and packed in export-safe cartons or wooden crates depending on size and weight.

Typical Thin-Film Applications

  • Chromium Cobalt Nickel High-Entropy Alloy (HEA) alloy films where composition control is important to electrical, mechanical, magnetic, or optical performance
  • Multilayer stacks, adhesion/barrier layers, conductive films, or functional coatings depending on the alloy system
  • Research and production programs that require customized alloy ratios and repeatable sputtering behavior

Target Configuration and Ordering Considerations

For quotation and manufacturability review, provide target size, thickness, purity or alloy composition, quantity, and the sputtering gun or cathode model if known. If a bonded assembly is required, include backing-plate material, bonding preference, and any dimensional tolerances, surface-finish needs, or inspection-document requirements. TFM can also review customer drawings or old-target samples for replacement builds.

Frequently Asked Questions

Can the composition of a Chromium Cobalt Nickel High-Entropy Alloy (HEA) sputtering target be customized?

Yes. For alloy targets, the required ratio should be specified clearly in wt% or at%. TFM can review custom compositions together with purity, dimensions, and manufacturability.

Will an alloy target always produce a film with the same composition?

Not necessarily. Preferential sputtering, substrate heating, process gas, and re-sputtering effects can shift the deposited composition relative to the nominal target chemistry. Film analysis should be used when the composition is critical.

Is a Chromium Cobalt Nickel High-Entropy Alloy (HEA) alloy target compatible with DC magnetron sputtering?

Many metallic alloy targets are electrically conductive and can be compatible with DC or pulsed-DC sputtering, but the final choice depends on the actual alloy system and equipment.

Why is alloy homogeneity important in a Chromium Cobalt Nickel High-Entropy Alloy (HEA) target?

A uniform alloy distribution helps support stable erosion and reduces local composition variation across the target, which in turn helps improve run-to-run consistency.

Can a Chromium Cobalt Nickel High-Entropy Alloy (HEA) target be supplied bonded?

Yes. Where the cathode or thermal load requires it, TFM can supply bonded assemblies. Backing-plate material, target thickness, bonding method, and operating power should be reviewed together.

What should I include in an RFQ for Chromium Cobalt Nickel High-Entropy Alloy (HEA)?

Specify the alloy composition, purity basis, dimensions, quantity, backing requirement, cathode model or drawing, and any tolerance, inspection, or documentation requirements.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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