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Strontium Cobalt Oxide Sputtering Target

ST0990 Strontium Cobalt Oxide Sputtering Target, SrCoO3

Chemical FormulaSrCoO3
Catalog No.ST0990
CAS Number–
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

TFM provides Strontium Cobalt Oxide Sputtering Targets that combine high quality with competitive pricing. Our extensive expertise ensures that you receive sputtering targets of exceptional purity and available in various sizes. We are committed to supplying top-grade materials that meet your research and production needs.

Strontium Cobalt Oxide Sputtering Target (SrCoO₃)

Introduction

Strontium Cobalt Oxide (SrCoO₃) Sputtering Target is a perovskite-type transition metal oxide widely studied for its mixed ionic–electronic conductivity, catalytic activity, and intriguing magnetic properties. SrCoO₃ thin films are of particular interest in solid oxide fuel cells (SOFCs), oxygen evolution reactions (OER), oxide electronics, and correlated electron systems. As a sputtering target, SrCoO₃ enables precise deposition of high-quality perovskite oxide films with controlled stoichiometry and reproducible functional performance.

Detailed Description

Our SrCoO₃ Sputtering Targets are fabricated from high-purity ceramic powders synthesized with strict control over Sr:Co stoichiometry and oxygen content. Maintaining phase stability is essential, as small variations in oxygen stoichiometry can significantly influence electrical conductivity, magnetic ordering, and catalytic behavior.

The targets are consolidated through optimized calcination and high-temperature sintering to achieve high density and uniform grain distribution. A dense microstructure minimizes particle ejection and ensures stable plasma conditions during RF sputtering. Due to its ceramic and partially semiconducting nature, SrCoO₃ is typically deposited using RF sputtering systems, although reactive sputtering configurations may also be employed to fine-tune oxygen content in the film.

Targets are available in standard circular or rectangular planar formats, with optional bonding to copper or titanium backing plates for enhanced thermal management during high-power operation.

Applications

Strontium Cobalt Oxide Sputtering Targets are widely used in:

  • Cathode materials for solid oxide fuel cells (SOFCs)

  • Oxygen evolution reaction (OER) catalytic films

  • Mixed ionic–electronic conducting thin films

  • Oxide heterostructures and electronic devices

  • Magnetic and strongly correlated oxide research

  • Academic and industrial R&D in perovskite oxides

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical CompositionSrCoO₃Determines conductivity and catalytic activity
Purity99.9% – 99.99%Reduces impurity-related defects
Diameter25 – 200 mm (custom available)Compatible with sputtering systems
Thickness3 – 6 mmInfluences target lifetime
Density≥ 95% theoreticalImproves plasma stability
Sputtering ModeRF sputteringRequired for ceramic oxides
BondingUnbonded / Cu or Ti backing (optional)Enhances heat dissipation

Comparison with Related Perovskite Oxides

MaterialKey AdvantageTypical Application
SrCoO₃High mixed ionic–electronic conductivitySOFC & catalytic films
La₁₋ₓSrₓCoO₃Tunable conductivityElectrode materials
SrFeO₃Oxygen transport capabilityCatalysis & energy devices
La₀.₇Sr₀.₃MnO₃Magnetoresistive behaviorSpintronics

FAQ

QuestionAnswer
Can oxygen stoichiometry be adjusted during deposition?Yes, oxygen partial pressure during sputtering can tune film properties.
Is RF sputtering required?Yes, SrCoO₃ is typically deposited using RF sputtering.
Are bonded targets available?Yes, metallic backing plates can be supplied upon request.
How is the target packaged?Vacuum-sealed with protective foam and export-grade cartons or crates.

Packaging

Our Strontium Cobalt Oxide Sputtering Targets are carefully labeled and vacuum-sealed to ensure traceability and protection from moisture and contamination. Export-grade packaging safeguards the targets during international shipment.

Conclusion

Strontium Cobalt Oxide (SrCoO₃) Sputtering Target provides a reliable platform for depositing advanced perovskite oxide thin films with excellent mixed conductivity and catalytic performance. With precise composition control, high density, and flexible customization options, it is well suited for energy devices, oxide electronics, and cutting-edge materials research.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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SrCoO₃ target 3N ø100×4mm Indium Bonded 2mm Cu B/Plate

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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