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Cobalt Aluminum Evaporation Materials

VD0611 Cobalt Aluminum Evaporation Materials, Co/Al

Catalog No.VD0611
MaterialCobalt Aluminum (Co/Al)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM specializes in producing high-purity cobalt-aluminum evaporation materials, ensuring exceptional product reliability through rigorous quality assurance processes. We offer these materials in various shapes, including tablets, granules, rods, and wires, to meet diverse application needs.

MSDS File

Cobalt Aluminum Evaporation Materials Description

TFM provides high-purity Cobalt Aluminum (Co/Al) evaporation materials, engineered for reliable performance in thermal and electron beam (e-beam) evaporation systems. These alloy materials combine the magnetic and catalytic characteristics of cobalt (Co) with the lightweight conductivity and corrosion resistance of aluminum (Al), making them ideal for use in multilayer thin films, magneto-optical coatings, and metal-insulator-metal (MIM) structures.

Cobalt-Aluminum films are particularly valued for their:

  • Tailorable electrical and magnetic properties

  • Strong adhesion to dielectric and metal substrates

  • Thermal and chemical stability in vacuum environments

  • Compatibility with patterned deposition processes

Cobalt Aluminum Evaporation Material Specification

PropertyValue
Chemical CompositionCo/Al alloy (e.g., 80:20, 70:30, 50:50 by atomic or weight %)
Purity≥ 99.95% (3N5) or higher
AppearanceMetallic gray or bluish pellets, slugs, or granules
FormPellets, shots, slugs, or custom-pressed pieces
Melting Point~1350–1450 °C (depends on composition)
Density~6.5–8.0 g/cm³ (varies by ratio)
Evaporation MethodThermal evaporation, e-beam evaporation
Typical Sizes1–10 mm pellets, 0.25–1 g pieces (custom formats available)
PackagingVacuum-sealed in moisture-proof containers with inert gas backfill

Custom alloy ratios and pellet shapes available upon request.

Applications of Cobalt Aluminum Evaporation Materials

  • Spintronics and magnetic tunnel junctions (MTJs)

  • Thin film read/write heads

  • Reflective and absorptive optical coatings

  • Barrier and contact layers in microelectronics

  • Nanostructured alloy studies and MEMS fabrication

Handling and Storage

  • Store in a dry, inert atmosphere; aluminum in the alloy can be reactive to air or moisture.

  • Handle with non-metallic tweezers or gloves to avoid contamination.

  • Avoid direct contact with acids or corrosive vapors.

Packaging

TFM ensures Cobalt Aluminum evaporation materials are carefully packaged in anti-static, vacuum-sealed containers or argon-filled glass vials. Each package is clearly labeled with material composition, purity, and batch number for traceability and quality assurance.

Get Contact

TFM manufactures and supplies Co/Al evaporation materials in a variety of alloy compositions, shapes, and purities to meet your thin film coating needs.
Contact us for quotes, custom orders, or technical guidance.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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