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Nickel Tungsten Evaporation Materials

VD0642 Nickel Tungsten Evaporation Materials, Ni/W

Catalog No.VD0642
MaterialNickel Tungsten (Ni/W)
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

TFM stands out as a premier producer and supplier of high-purity nickel tungsten evaporation materials. We also offer a wide variety of other evaporation materials, available in both powder and granule forms. Our products can be tailored to meet your precise needs, ensuring you get exactly what you’re looking for.

MSDS File

Nickel Tungsten Evaporation Materials Overview

TFM provides high-purity nickel tungsten evaporation materials, an alloy comprising nickel (Ni) and tungsten (W). Our high-purity materials, reaching up to 99.9995% purity, are crucial in deposition processes, ensuring the production of high-quality films. TFM utilizes rigorous quality assurance protocols to guarantee the reliability and performance of our products.

Applications of Nickel Tungsten Evaporation Materials

Nickel tungsten evaporation materials are essential in several advanced applications, including:

  • Deposition processes such as semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics applications, including wear-resistant coatings, decorative finishes, and display technologies.

Packaging and Handling

We prioritize the careful handling of our nickel tungsten evaporation materials to prevent any damage during storage and transport. This attention to detail helps maintain the integrity and quality of our products.

Contact Us

As a leading provider of high-purity nickel tungsten evaporation materials, TFM offers products in various forms, including tablets, granules, rods, and wires. We also provide customized shapes and quantities to suit your specific needs. In addition to evaporation materials, TFM supplies evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing or to inquire about products not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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