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Bismuth Ferrite (Garnet) Evaporation Materials

VD0676 Bismuth Ferrite (Garnet) Evaporation Materials, Bi3Fe5O12

Catalog No.VD0676
MaterialBismuth Ferrite (Garnet
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM is a prominent manufacturer and supplier of high-purity bismuth ferrite (Garnet) evaporation materials, as well as a broad range of other evaporation materials. We provide these materials in both powder and granule forms and offer customized options to meet specific requirements upon request.

MSDS File

Bismuth Ferrite (Garnet) Evaporation Materials Overview

TFM offers high-purity bismuth ferrite (Garnet) evaporation materials, with the chemical formula Bi₃Fe₅O₁₂. These oxide materials are essential for achieving high-quality films in various deposition processes. Our bismuth ferrite (Garnet) materials are produced with up to 99.9995% purity, supported by stringent quality assurance processes to ensure reliable performance.

Related Products: Bismuth Evaporation Materials, Iron Evaporation Materials

Applications of Bismuth Ferrite (Garnet) Evaporation Materials

Bismuth ferrite (Garnet) evaporation materials are utilized in:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Used in wear protection, decorative coatings, and display technologies.

Packaging and Handling

Our bismuth ferrite (Garnet) materials are carefully tagged and labeled to ensure efficient identification and quality control. We take all necessary precautions to prevent damage during storage and transportation.

Contact Us

TFM is a leading supplier of high-purity bismuth ferrite (Garnet) evaporation materials, available in various forms such as tablets, granules, rods, and wires. Customized shapes and quantities can be provided upon request. In addition to evaporation materials, we offer evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and information on materials not listed, please contact us with your inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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