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Lanthanum Aluminate Evaporation Materials

VD0697 Lanthanum Aluminate Evaporation Materials, LaAlO3

Catalog No.LaAlO3-VD
MaterialLanthanum Aluminate (LaAlO3)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM is a premier manufacturer and supplier of high purity lanthanum aluminate evaporation materials, along with a diverse range of other evaporation materials. We provide our lanthanum aluminate materials in both powder and granule forms. For those with unique requirements, customized forms are also available upon request.

 

MSDS File

Lanthanum Aluminate Evaporation Materials Overview

TFM offers high purity lanthanum aluminate evaporation materials, an essential component in oxide evaporation with the chemical formula LaAlO3. These materials are crucial for achieving high-quality deposited films in various deposition processes. Our lanthanum aluminate materials are produced to a purity level of up to 99.9995%, supported by stringent quality assurance measures to ensure product reliability.

Related Products: Lanthanum Evaporation Materials, Aluminum Evaporation Materials

Specifications

Material TypeLanthanum Aluminate
SymbolLaAlO3
Color/AppearanceTan to brown
Melting Point2,080 °C
Theoretical Density 6.52 g/cm3
Purity99.5% ~ 99.99%
ShapePowder/ Granule/ Custom-made

Applications

Lanthanum aluminate evaporation materials are utilized in:

  • Deposition processes, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics applications, such as wear protection, decorative coatings, and display technologies.

Packaging

Our lanthanum aluminate evaporation materials are meticulously tagged and labeled for efficient identification and quality control. We take extensive care to prevent any damage during storage and transportation.

Contact Us

TFM is a leading provider of high purity lanthanum aluminate evaporation materials, available in various shapes including tablets, granules, rods, and wires. Customized forms and quantities can be accommodated upon request. We also supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing or to inquire about other materials not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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