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VD0721 Praseodymium(III,IV) Oxide Evaporation Materials, Pr6O11

Catalog No.VD0721
MaterialPraseodymium Oxide (Pr6O11)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM is a top manufacturer and supplier specializing in high-purity praseodymium(III,IV) oxide evaporation materials. In addition to praseodymium(III,IV) oxide, we provide a wide range of other evaporation materials to meet diverse industry needs. Our materials are available in both powder and granule forms, with the option for customized shapes and sizes tailored to your specific requirements.

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Praseodymium(III,IV) Oxide Evaporation Materials Overview

TFM offers high-purity praseodymium(III,IV) oxide evaporation materials, known for their excellent performance in deposition processes. With the chemical formula Pr6O11, this oxide material is vital for achieving high-quality film deposition. At TFM, we specialize in producing evaporation materials with purities up to 99.9995%, ensuring product reliability through stringent quality assurance practices.

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Praseodymium(III,IV) Oxide Evaporation Materials Specifications

Material TypePraseodymium(III,IV) oxide
SymbolPr6O11
Color/AppearanceDark brown solid
Melting Point2,183 °C
Theoretical Density 6.5 g/mL
Purity99.9% ~ 99.99%
ShapePowder/ Pellets/ Granule/ Custom-made

Applications of Praseodymium(III,IV) Oxide Evaporation Materials

TFM’s praseodymium(III,IV) oxide evaporation materials are essential in various applications, such as:

  • Deposition Processes: Utilized in semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Used for wear protection, decorative coatings, and display technologies.

Packaging and Handling

Each package of praseodymium(III,IV) oxide evaporation materials is clearly labeled and tagged to ensure easy identification and strict quality control. We prioritize safe packaging to prevent any potential damage during storage or transport, maintaining the material’s integrity.

Contact TFM

As a leading supplier of high-purity praseodymium(III,IV) oxide evaporation materials, TFM offers a variety of shapes including tablets, granules, rods, and wires. We also provide custom forms and quantities upon request. Additionally, TFM supplies a range of evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. Please contact us for current pricing or inquiries about other materials not listed.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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