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Titanium Disilicide Evaporation Materials

VD0807 Titanium Disilicide Evaporation Materials, TiSi2

Catalog No.VD0807
MaterialTitanium Silicide (TiSi2)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top-tier manufacturer and supplier specializing in high-purity titanium silicide evaporation materials. Our extensive range includes various evaporation materials, available in both powder and granule forms. For tailored needs, we also provide customized options to meet specific requirements.

MSDS File

Titanium Disilicide Evaporation Materials Overview

Our titanium disilicide evaporation materials at TFM are high-purity silicide ceramic products, identified by the chemical formula TiSi₂. These materials are crucial in various deposition processes, ensuring the creation of superior-quality films. At TFM, we focus on delivering titanium disilicide with a purity of up to 99.9995%, thanks to our rigorous quality assurance measures which ensure both reliability and performance.

Related Products: Titanium Evaporation Materials

Specifications of Titanium Disilicide Evaporation Materials

Material TypeTitanium disilicide
SymbolTiSi2
Appearance/ColorBlack orthorhombic crystals
Melting Point1,470 °C (2,680 °F; 1,740 K)
Density4.02 g/cm3
Purity99.5%
ShapePowder/ Granule/ Custom-made

Applications of Titanium Disilicide Evaporation Materials

Our titanium disilicide materials are utilized in several deposition techniques, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). These materials are particularly suited for applications in optics, such as wear protection, decorative coatings, and display technologies.

Packaging and Quality Assurance

We ensure that our titanium disilicide evaporation materials are meticulously tagged and labeled for clear identification and quality control. Special attention is given to prevent damage during storage and transportation, preserving the integrity of the product.

Contact Us

TFM is a leading provider of high-purity titanium disilicide evaporation materials. We offer a variety of shapes, including tablets, granules, rods, and wires, with custom options available upon request. In addition to evaporation materials, we also supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For pricing information or inquiries about materials not listed, please reach out to us directly.

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Titanium Silicide Granules, TiSi2-99.9%, 1~8mm, 100g, Titanium Silicide Granules, TiSi2-99.9%, 1~8mm, 500g

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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