Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors

VD0810B AgInS2 Pellet Evaporation Material (AgInS2)

MSDS File
Material TypeAgInS2
SymbolAgInS2
Melting Point (°C)
Theoretical Density (g/cc)
Z Ratio
E-Beam
E-Beam Crucible Liner Material
Temp. (°C) for Given Vap. Press. (Torr)
Comments

AgInS2 Pellet Evaporation Material

TFM offers high-purity AgInS2 Pellet Evaporation Material, designed for thin-film deposition in semiconductor, optoelectronic, and photovoltaic applications. Composed of silver (Ag), indium (In), and sulfur (S), AgInS2 is widely recognized for its excellent optical, electrical, and thermoelectric properties, making it an essential material for next-generation device fabrication.

Optimized for thermal evaporation and electron beam (E-beam) evaporation, AgInS2 Pellet Evaporation Material ensures uniform film deposition with high density, superior adhesion, and minimal impurities.

Key Features and Advantages

  • High Purity & Precise Stoichiometry: Maintains an optimized AgInS2 phase, ensuring superior film quality for semiconductor and optical applications.

  • Exceptional Optical & Photovoltaic Properties: Exhibits a direct bandgap suitable for solar cells, photodetectors, and optoelectronic devices.

  • Strong Infrared Absorption: Ideal for infrared (IR) detectors, thermal imaging systems, and optical sensors.

  • Uniform & High-Density Film Deposition: Produces smooth, defect-free thin films with excellent adhesion to various substrates.

  • Stable Thermal & Chemical Behavior: Maintains structural integrity in high-temperature processing environments, ensuring long-term performance.

Applications

  • Photovoltaic & Solar Energy Devices: Used in thin-film solar cells for its high light absorption and conversion efficiency.

  • Infrared & Optical Sensors: Essential for thermal imaging cameras, IR photodetectors, and optical communication devices.

  • Semiconductor & Optoelectronic Devices: Plays a role in LEDs, lasers, and advanced electronic components.

  • Thin-Film Transistors (TFTs): Supports stable and efficient electrical performance in high-tech circuit designs.

Industry Impact and Customization

TFM’s AgInS2 Pellet Evaporation Material enables innovation in thin-film deposition technology, offering customizable material properties to meet specific industry requirements. Our advanced manufacturing process ensures optimized film density, stoichiometry, and deposition precision, ensuring superior performance in photovoltaics, infrared imaging, and semiconductor applications.

With its outstanding electrical, optical, and thermal properties, TFM’s AgInS2 Pellet Evaporation Material is a vital component for high-performance thin-film coatings, providing reliable and efficient results across multiple high-tech industries.

Reviews

There are no reviews yet.

Be the first to review “VD0810B AgInS2 Pellet Evaporation Material (AgInS2)”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

Shopping Cart
Scroll to Top